West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally.
West Bond has a history of over 40 years as a pioneer in wire bonding and has been favored by many customers both domestically and internationally. Our company has also been the exclusive distributor for West Bond in Japan for over 40 years, handling import, sales, and support. Among our products, the model 7700D has a proven track record of numerous installations in government agencies, universities, and various research institutions, and its operability using the patented new mechanism X-Y-Z 3-axis manipulator has received high praise from users. Additionally, it enables easy bump bonding, making it highly recommended for customers considering flip chip bonding.
Inquire About This Product
basic information
【Features】 ○ New mechanism X-Y-Z 3-axis manipulator (patented) ○ Capable of gold wire ball bonding and bump bonding ○ Capable of bump bonding to bare chips with a 0.3mm square size ○ No need for height adjustment of the wire bonding surface ○ Achieves stable wire field performance ● For more details, please contact us.
Price information
-
Delivery Time
Applications/Examples of results
For more details, please contact us.
Company information
We will listen to your requests and provide the optimal solution.