Cure device
The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder to feeding it into the cure furnace, storing it in a magazine, and discharging the magazine.
Inquire About This Product
basic information
The cure device is a clean cure apparatus that overheats the lead frame after die bonding from both the top and bottom while purging with N2 hot gas simultaneously. This equipment automatically performs a series of operations from directly receiving the lead frame from the die bonder, feeding it into the cure furnace, to storing it in the magazine and discharging the magazine.
Price information
-
Delivery Time
Applications/Examples of results
It refers to a curing furnace that applies heat after die bonding, where IC chips are attached to a frame called a lead frame in the final stage of semiconductor manufacturing, to cure the adhesive (such as silver paste).
Company information
【Corporate Philosophy】 - Challenge - Trust - Gratitude Based on the above philosophy, while enhancing our comprehensive responsiveness to customers using our equipment, we will make proposals focusing on: - Advancement - Diversification - Price emphasis.