Substrate bonding (direct bonding, anodic bonding, vacuum sealing)
This is an introduction to Kenix's "Vacuum Sealing and Bonding Equipment," which manufactures and sells custom-made products. ■□■Features■□■ ■Compatible with anodic bonding, direct bonding, and thermal compression bonding ■Compatible with wafer-level to chip-level bonding ■Heating area and temperature: φ6cm, Max 1,000℃ ■Pressure: Max 1,000kg/cm2 ■Atmospheric pressure: Vacuum to pressurized atmosphere ■Various MEMS sensors, microchips, and next-generation devices ■Surface modification unit can be optionally installed For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.
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This is an introduction to Kenix's "Vacuum Sealing and Bonding Equipment," which manufactures and sells custom-made products. ■□■Features■□■ ■Compatible with anodic bonding, direct bonding, and thermal compression bonding ■Flexible bonding from wafer level to chip level ■Heating area and temperature: φ6cm, Max 1,000℃ ■Pressure: Max 1,000kg/cm² ■Atmospheric pressure: Vacuum to pressurized atmosphere ■Various MEMS sensors, microchips, and next-generation devices ■Surface modification unit can be optionally installed For custom-made semiconductor manufacturing equipment, scientific instruments, and accessories, please leave it to us. For more details, please contact us.
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We manufacture and sell custom-made products that satisfy our customers. We also respond to various other requests.