EFEM（Equipment Front End Module）
This device is a 2-station FOUP/FOSB compatible EFEM (Equipment Front End Module). It supports wafer sizes of 200/300mm (8/12 inches). Throughput: 150 wph OCR / 450 wph transfer (excluding processes).
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basic information
This device is a 2-station FOUP/FOSB compatible EFEM (Equipment Front End Module). It supports wafer sizes of 200/300mm (8/12 inches). Throughput: 150 wph OCR / 450 wph transfer (excluding processes).
Price information
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Delivery Time
Applications/Examples of results
FOUP opening and transport module for 300mm wafer compatible devices Single interface compatible RS232C multi-port Compliant with SEMI S2 and S8 We can accommodate special specifications and inquiries.
Company information
Our company primarily engages in: 1. Sales and services of new equipment (plasma treatment equipment, wafer transporters (sorters), inspection equipment, etc.) 2. Sales and services of used semiconductor manufacturing equipment 3. Development, manufacturing, and consulting of equipment based on customer needs. Additionally, leveraging our network with companies both domestically and internationally, we accept inquiries regarding our customers' diverse needs, not limited to the semiconductor industry.