FC/COG/COF Bonder Market FC Implementation Technology Trend Analysis 2004
This report predicts the overall demand for FC implementation by conducting demand forecasts based on specific applications in the steadily growing field of FC implementation. Furthermore, as part of the FC bonder section, it summarizes the market, manufacturer share, future trends, etc., for each type of bonder, including COG, COF, ultrasound, and general-purpose FC. The report provides a forecast of demand trends for FC implementation while also clarifying the FC bonder market.
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basic information
The implementation of FC has seized the opportunity for expansion in the LCD field, and the market has significantly grown due to its adoption in mobile phones. Additionally, its adoption as one of the IC packaging technologies has been a major factor in the expansion of applications. In other words, it has been adopted as an inner connection technology for IC packages, utilized in BGA, CSP, and SiP internal connection technologies. As a result, applications have expanded to include personal computers, digital cameras, digital camcorders, mobile phones, gaming consoles, and more. The development of this FiP (Flip Chip in Package) technology has also been a significant factor in the expansion of FC implementation. With the expansion of FC implementation, the FC bonder market has also grown. In the LCD field, dedicated FC bonder mount machines for COG and COF bonders have expanded. Furthermore, due to the expansion of applications and the market, the adoption of general-purpose FC bonders has also progressed. The diversification of FC implementation has led to substantial growth in the FC bonder market.
Price information
99,750 yen
Price range
P2
Delivery Time
P4
Applications/Examples of results
Market data for FC bonders, COG bonders, COF bonders, and ultrasonic FC bonders Trends in FC packaging technology
Company information
A market and technology research company specialized in the field of implementation technology: chip mounters, semiconductor assembly equipment, automatic visual inspection, IC packages, BGA/CSP/FC.
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