50-piece batch plasma ashing system (asher) compatible with 6-inch and 8-inch wafers. There is also a wafer single-piece processing type available.
We offer high-performance devices at low prices. Ashing rate: over 300 Å, in-plane uniformity: ±20% or less, inter-batch uniformity: ±20% or less, processing capacity: 150 wafers/hour (calculated at RF0 minutes). We also provide low-cost batch-type ashers and etchers. We accept retrofitting of aging equipment as well.
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basic information
- Achieves low cost and space-saving (4-inch and 5-inch wafers are available as options) - Allows for ashing and surface modification with low damage - A plasma ashing device that can process 50 wafers in a single batch, suitable for various processes.
Price information
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Delivery Time
Applications/Examples of results
Ash removal of photoresist films on silicon wafers, sapphire substrates, and surface hydrophilization treatment.
Company information
We have received high praise from semiconductor manufacturers for our development of IC sockets for semiconductor evaluation. Currently, we flexibly and swiftly respond to the diverse needs of automotive electronics, image sensors, and semiconductor manufacturers, providing a comprehensive proposal of materials necessary for development, prototyping, evaluation, production, and shipping. We also boldly challenge ourselves in the development of new products, supporting the rapidly changing electronics industry. Additionally, as of October 1, 2006, Yamato Glass has changed its company name to Yamato Material Co., Ltd. to aim for greater possibilities, with the goal of further business expansion alongside the penetration of an accurate corporate brand image.
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