Various chemicals are used as opening agents to dissolve the mold and open it.
Various chemicals are used as opening solutions to dissolve the mold and open it. Additionally, it is possible to remove passivation films and multilayer wiring. FIB processing is also available through partner companies.
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basic information
【Features】 ○ Various chemicals are used as opening agents to dissolve the mold and open it. ○ Standard opening (feasibility of operation) ・ FIB processing ・ Characteristic measurement ・ Others ○ Special opening ・ Chip observation ・ Wire observation ・ Structural analysis ・ Chip only ・ Chip measurement ・ Substrate mounting ・ Others ● For other functions and details, please contact us.
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Company information
We provide high technical support for customer requirements in space, automotive applications, and from consumer to industrial sectors. 【Our Features】 - ISO/IEC 17025 accredited testing laboratory - Comprehensive support from reliability testing to analysis - Reasonable pricing - Quick response
