A solder paste printer that realizes a variety of printing forms made possible by the press-in method!
This is a printing machine that solely pursues stable high-quality printing. It is equipped with a uniquely developed press-in squeegee unit, capable of meeting various printing needs from high-density patterns to large-diameter thick film printing. (Main Features) ● The cartridge, which is shielded from outside air, stores solder paste, preventing deterioration such as oxidation. ● The rotation pressure of the roller shaft inside the cartridge reliably fills the solder paste into the mask opening. ● The automatic solder paste replenishment function maintains a constant amount of solder paste within the cartridge. ● The automatic stirring mechanism keeps the viscosity of the solder paste inside the cartridge consistent. ● After squeegeeing, the machine automatically recovers the solder paste each time, leaving no solder paste on the mask. ● By combining contact printing and off-contact printing, the "hybrid squeegeeing" accommodates a variety of printing forms. *For more details, please request materials or view the PDF data available for download.
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basic information
1. Features of the Press-in Type Squeegee Unit ● The cartridge, which is shielded from the outside air, stores solder paste, preventing deterioration such as oxidation. ● The rotation pressure of the roller shaft inside the cartridge reliably fills the solder paste into the mask opening. ● The automatic solder paste replenishment function maintains a constant amount of solder paste in the cartridge. ● The automatic stirring mechanism keeps the viscosity of the solder paste in the cartridge consistent. ● After squeegeeing, all solder paste is automatically recovered each time, leaving no solder paste on the mask. ● The "hybrid squeegeeing" that combines contact printing and off-contact printing can accommodate various printing needs. 2. Features of the Metal Mask Cleaner (DRY & WET) ● The sandwich structure allows for strong contact from both sides of the mask, achieving stable cleaning effects. ● The WET cleaner adopts a complete washing method to fully remove solder particles and flux residues from the mask openings.
Price information
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Price range
P7
Delivery Time
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Applications/Examples of results
General surface mounting Bump printing on substrate boards (bump pitch 150-200μm) Wafer bump printing (bump pitch 120-200μm) Filling of conductive paste (hole filling)
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Company information
Our business consists of three core areas: SMT (Surface Mount Technology) related business, semiconductor related business, and product development business. Our strength lies in providing one-stop services from assembly of printed circuit boards utilizing the features of our in-house developed solder paste printing machines to unit assembly and repair services for touch panels and display products. Additionally, we are capable of producing products certified under ISO9001, ISO14001, as well as ISO13485 for medical devices and UL standards. On the other hand, in the semiconductor related business, we have solved many customer challenges with our advanced printing technology and know-how. We are developing a business model where our main SMT related business and semiconductor related business are supported by the product development business from both software and hardware perspectives.