List of Electronic Components and Modules products
- classification：Electronic Components and Modules
2896～2910 item / All 59523 items
High-performance and simple strip machine.
- Other processing machines
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Achieved stable bonding through high-rigidity horn clamp technology (rigid clamp)!
- aluminum
- Secondary Cells/Batteries
Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]
【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000
We have achieved continuous welding of CFRTP, which was difficult with conventional technology, through our unique ultrasonic welding technology.
- Secondary Cells/Batteries
- Plastic processing machines (cutting and rolling)
Introduction to Ultrasonic Application Devices / Welding, Joining, and Cutting Methods [Online Seminar]
【Overview】 Date and Time: September 25 (Friday) 10:00 AM - 11:00 AM (Registration starts at 9:30 AM) Theme: Introduction to Adwells' Ultrasonic Application Devices / Welding, Joining, and Cutting Techniques Content: - Welding: A new technology for continuously welding CFRTP using ultrasonic waves. We will introduce applicable applications including processing examples and existing methods. - Joining: We will present technologies that solve challenges in metal joining for product development. - Cutting: We propose ultrasonic cutting for high-precision cutting of high-performance materials. It can cut rubber, resin, green sheets, etc., with high precision and without dragging burrs. - Seminar Participation Registration URL: https://www.nissei.co.jp/machinery - Product Overview Introduction Pages Ultrasonic Joining Device: http://ma.imsys.jp/r/1272880?m=0000&c=00000000 Ultrasonic Welding Device: http://ma.imsys.jp/r/1272879?m=0000&c=00000000 Ultrasonic Cutter: http://ma.imsys.jp/r/1272881?m=0000&c=00000000
Compact and made of plastic, Teflon, cardboard products, etc., are expected to enable long-distance reading.
- IC tag reader/writer
- IC tag
We would like to propose a unit roller that meets your specifications.
- Printed Circuit Board
- LCD display
- Secondary Cells/Batteries
Business improvement solution for promoting DX and IoT implementation: Asset and inventory management system using RFID.
- IC tag
Sensor/IoT/AI Technology Exhibition 2024
Nippon Seiki Co., Ltd. will exhibit at the "Sensor/IoT/AI Technology Exhibition 2024" to be held on Friday, August 30, 2024. ≪Overview of the Sensor/IoT/AI Technology Exhibition 2024≫ Date: Friday, August 30, 2024 Time: 10:30 AM - 4:30 PM Venue: Osaka Industry Creation Center 1-4-5 Honmachi, Chuo-ku, Osaka 541-0053 Booth Number: 4th Floor, No. 17 Admission Fee: Free (Pre-registration required) ■Main Exhibits 【DX Support Tools】 ・Item management solution using RFID Contributes to "solving labor shortages" and "improving productivity" by reducing search and inventory times. Experience overwhelming work speed! ・Vibration diagnosis system using Smart Tag Remote monitoring of machinery and equipment using Smart Tag (vibration sensor). Immediate observation of equipment with color display based on thresholds, allowing for constant remote monitoring of whether machinery is operating stably! Both will be demonstrated live! We sincerely look forward to your visit.
Achieve automation of IC packaging with space-saving design! Inspection equipment capable of high-precision 2D and 3D dimensional measurement.
- Microcomputer
High-speed Die Bonder compatible with micro and thin chips!
- Printed Circuit Board
- Substrate transport device (loader/unloader)
Comfortable internal and external meetings with easy wireless transmission and reception equipment!
- Other cable related products
Optimized for jewelry and cosmetics applications, providing high performance and excellent adhesion features.
- IC tag reader/writer
- IC tag
High-capacity type IC tag. Exhibits excellent resistance and performance even in harsh environments such as thick paper, plastic, low detuning materials, and others.
- IC tag reader/writer
- IC tag
We have realized a circularly polarized antenna using a substrate antenna.
- antenna
- Sensors
Compatible with GPS! A variety of antenna solutions available with numerous TELEC achievements.
- antenna
Quickly catch the needs! We respond with a wealth of partners and reliable technical expertise.
- Other machine elements
- Resin mold
- Other Connectors
Remove stubborn foreign substances such as grease, ink, glue, adhesive debris, dust, and dirt that remain on the work surface! Customizable to fit your work size!!!
- Printed Circuit Board
- lens
- LCD display