List of Electronic Components and Modules products
- classification：Electronic Components and Modules
5896～5940 item / All 60815 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
I will explain the features and basic structure of OCT, as well as its applications.
- Other optical parts
Minimum shape dimension 0.2μm Innovate your business with ultra-fine 3D printing services!!
- lens
- Microscope
- Microarrays and DNA chips
Utilizing lost-wax technology that handles various materials. Leave the prototypes aimed at weight reduction to us!
- Other industrial robots
- Other machine elements
- Other electronic parts
I was involved in the production of the "touchable" model of Kencho-ji Temple in Kamakura City.
The "touchable" model of Kenchoji Temple was conceived by the Universal Picture Book Library UniLeaf (represented by Toshie Oshima, located in Hayama, Kanagawa Prefecture) with the concept of allowing visually impaired individuals to feel historical buildings with their hands, enabling them to share the excitement of travel together. Subsequently, it received support from many donors through grants from the "Support Each Other Fund" and crowdfunding, leading to its production. To realize the concept of feeling historical buildings by touch, a 1/50 scale miniature of the Kenchoji Temple Buddha Hall was meticulously recreated in bronze, paying close attention to detail. Our company was responsible for the production of the castings, which consist of approximately 30 parts. This in-house technology utilizes a casting method called "Digital Cast," which excels in producing unique, one-of-a-kind items without the need for mold fabrication. The model has been permanently installed in front of the Kenchoji Temple Buddha Hall since the day after the ceremony, allowing visitors to touch it freely. If you visit Kenchoji Temple in Kamakura, please take a look. [Manufacturing Responsible] Prototype resin model production and casting machining: JMC Corporation Casting (moldless casting "Digital Cast"): Castem Corporation
Applications in position, distance, and shape measurement are expected in various scenarios.
- Other optical parts
We will accurately fulfill your wishes for vision installation in a one-stop service!
- LCD display
I will explain the types and principles of important devices that amplify light at high speeds.
- Other optical parts
Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!
- diode
Explanation of the basic principles and applications of "saturable absorption materials" and "saturable absorption mechanisms."
- Laser Components
Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.
- Other semiconductors
Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.
- Other semiconductors
Fiber optic cables with a heat resistance temperature of up to 250℃! You can choose from three types of transmission wavelengths according to your measurement content and application.
- LAN/Optical cable
- Other electronic parts
Maspower_E096-1A_96W_Constant Voltage AC Adapter
- power supply
faytech, ultra-thin casing, optical bonding compatible, supports power, video, and touch signals with a single USB Type-C, capacitive touch.
- LCD display
Introducing high-performance, high-efficiency products that meet strict industry standards!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Significantly improved design flexibility in applications with space constraints!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Additional board maintenance is possible! Ensures minimization of contact resistance between the wire and crimp barrel.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Provides essential power efficiency for cost management! Designed for manufacturing flexibility and excellent electrical performance.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Multiple types of circuit board stacking designs are possible, providing flexibility in design!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Maspower S100-1A 100W Constant Voltage AC Adapter
- power supply
Maximize high-speed transmission processing performance and clean routing away from the connector installation area!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
The flexible cable link provides relaxed tolerances and architectural flexibility!
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Cost reduction through hermaphroditic design! Shortened lead time and simplified product matrix.
- Other Connectors
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Providing a high-density and slim solution for interconnecting with SI performance!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
An OCP-recommended internal I/O connector solution designed specifically for boot drive applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Designed for internal wiring, enabling support for artificial intelligence (AI) and machine learning applications!
- Board to Board Connectors
- connector
- connector
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
faytech, ultra-thin casing, supports optical bonding, powered and video transmission via a single USB Type-C cable.
- LCD display
Achieving streamlined integration and rapid implementation through a male-female dual-body design!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Equipped with 101 pairs of high-density modular interfaces per square inch!
- Other Connectors
- cable
Notice of Molex WEB Seminar "Current High-Speed, High-Current, and Heat Dissipation Solutions for Data Centers" to be held on April 22, 2026 (Wednesday).
"Current High-Speed, High Current, and Heat Dissipation Solutions for Data Centers" We would like to inform you about the Molex webinar. In this webinar, we will introduce high-speed connection solutions compatible with 112Gbps/224Gbps, high-density mezzanine connections for AI-oriented GPUs, high current power connection technologies, and heat dissipation products, comparing the evolution of technology to current solutions. We will provide valuable information for everyone involved in data center equipment design, so please join us.
Maspower_S120-1B_120W_Constant Voltage AC Adapter
- power supply
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of aircraft.
- Ultrasonic Oscillator
We will ensure the safety of the fuel tank of the space rocket.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of weapons.
- Ultrasonic Oscillator
Wheel inspection using ultrasonic flaw detection devices that support the safe operation of railways.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices to ensure the safety of piping.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that ensure plant safety.
- Ultrasonic Oscillator
Method for regular inspection of ultrasonic flaw detection devices to improve the quality of automotive parts.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic testing devices to ensure the safety of hull welding.
- Ultrasonic Oscillator
Comparing the differences in conductivity, cost, and weight!
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Regular inspection methods for ultrasonic flaw detection devices that ensure the safety of bridges.
- Ultrasonic Oscillator
Regular inspection methods for ultrasonic flaw detection devices that support the safe operation of turbines.
- Ultrasonic Oscillator
Quick response for copper busbar processing for electrical equipment.
- transformer
The participation in the JECAFAIR 2026 Electrical Industry Exhibition has been confirmed.
We have decided to exhibit at "JECAFAIR 2026 Electric Construction Industry Exhibition," which will be held at Tokyo Big Sight from May 27 (Wednesday) to May 29 (Friday). We will be exhibiting right at the entrance of booth number 1-54 in Hall 1 East. On the final day, our on-site workers, who process 150 tons of copper busbars annually, will share insights about the characteristics of copper, the challenges of processing, and information that only those on-site would know during the exhibitor seminar! For more details, please visit the official website! We sincerely look forward to your visit!
Introducing the regular inspection methods for ultrasonic testing devices in the aerospace field.
- Ultrasonic Oscillator