List of Manufacturing and processing machinery products
- classification：Manufacturing and processing machinery
9451～9465 item / All 98103 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
Light curtains that protect operators from danger, equipped with an emergency stop button as standard!
- Other machine tools
- fastener
- Contract manufacturing
Original head shape for "prank prevention"! Excellent torque transmission improves work efficiency!
- fastener
- Plastic processing machines (cutting and rolling)
A single washer can change the design.
- Other processing machines
The screw head has been made thinner. It saves space and is a screw that fulfills the designer's vision.
- AC adapter
- Plastic processing machines (cutting and rolling)
- Other cutting tools
Please let us know your concerns! We will create a custom design tailored to your needs.
- Transport and handling robots
- Other industrial robots
Achieving fully immersed UD tape manufacturing with a groundbreaking device size.
- Other processing machines
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
This is a mass production ultrasonic metal joining device suitable for inverter production!
- Other processing machines
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Compatible with a wide range of applications! A multifunctional ultrasonic welding system integrated in a compact design.
- Other processing machines
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
In addition to joining the same type of metal, welding enables the joining of different types of metals that is difficult to achieve!
- Welding Machine
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Ideal for power devices! The ultrasonic head is highly rigid and compact!
- Welding Machine
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Stable ultrasonic bonding technology using rigid clamps applicable to a wide range of applications.
- Processing Contract
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Ultrasonic cutting technology that achieves a clean cut surface without warping, bending, or dragging of composite materials.
- Processing Contract
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Directly forming heat dissipation fins (pin fins/ribbon fins) on the back of the substrate achieves a high thermal conductivity (approximately 34 times that of TIM and about 7 times that of solder).
- Welding Machine
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.
Development of advanced semiconductor packaging technology such as three-dimensional semiconductors using ultrasonic bonding processes.
- Other processing machines
Notice of Participation in "JPCA Show 2025" from June 4 (Wednesday) to June 6 (Friday), 2025.
Adwells Co., Ltd. will be exhibiting at the "JPCA Show 2025 (Total Solution Exhibition for Electronic Devices)" held at Tokyo Big Sight. At the exhibition, we will introduce ultrasonic application technologies such as heat sink formation, power module bonding, DMB bonding, flexible substrate bonding, and ultrasonic cutting. Additionally, we plan to display a variety of samples processed with our equipment from various fields, which we believe will be helpful in realizing new ideas and solving challenges. We invite you to visit our booth when you attend the event.