List of Contract Services products
- classification：Contract Services
721～765 item / All 2073 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
A belt grinding machine that has been in use for about 50 years since 1973. In addition to trust and proven results, the lineup is also extensive.
- Other machine tools
Belt grinding machine "Veda Machine" has high durability and a wide range of service parts.
The "Bader Machine" is our belt grinder that boasts excellent polishing performance for each individual unit. By selecting models and types according to the shape and size of the workpiece, and by equipping it with a polishing belt suitable for the task, it can flexibly accommodate a wide variety of items across various fields. Please make extensive use of it for high-efficiency polishing and grinding, reduction of work time, labor-saving, and standardization of tasks. 【Lineup】 ■ Portable type BP-K (air motor type) ■ Made-to-order machine PC-1 (wheel centerless), BC (standard dust cover) ■ Installed type BM (basic type), SBA-1, BH-2 ■ Wheel type SBD-4S, SBD-7, BWd *For more details, please download the PDF or contact us.
We contribute to society while maintaining a balance of satisfaction among customers, employees, and the company.
- Mechanical Design
- Circuit board design and manufacturing
- Temporary staffing business
Generally, high multilayer stacking technology is adopted in manufacturing.
- Circuit board design and manufacturing
Six-layer substrate assembly
- Circuit board design and manufacturing
Microsection inspection of PCB
Microsection inspection is an important quality analysis method for evaluating interlayer connections and conductor shapes in printed circuit boards (PCBs). This inspection method is typically performed on completed PCBs to ensure that the conductors between each layer meet design requirements and production standards, or to sample and analyze specific locations in case of defects in the product to identify the causes of abnormalities. When conducting microsection inspection, a sample of a specific size is first cut from the completed PCB, and its surface is polished to reveal the internal structure. Then, a microscope is used to observe and photograph the microsection, showing the vias, conductive layers, and dielectric layers of the PCB.
We will respond to requests starting from one unit with the shortest possible delivery time.
- EMS
- Circuit board design and manufacturing
- Processing Contract
Technicians who have passed our certified examination achieve precise soldering while observing through a stereo microscope.
- Circuit board design and manufacturing
- EMS
- Contract manufacturing
We can perform not only surface mounting but also other processes consistently!
- EMS
- Printed Circuit Board
- Solder
We are engaged in the development of power supply systems in various fields. We design and produce low-noise, high-efficiency switching power supplies according to our customers' requests!
- Circuit board design and manufacturing
Enhancing the aesthetic appeal of aluminum with colored anodizing.
- Other machine elements
- Circuit board design and manufacturing
- Other semiconductor manufacturing equipment
Sharing information connected by point clouds! The utilization of point cloud data will bring transformation to construction sites.
- Circuit board design and manufacturing
We provide comprehensive design services for electronic circuits.
- Other electronic parts
- Printed Circuit Board
- Circuit board design and manufacturing
Leveraging the strengths of a "ceramics substrate specialized manufacturer," we have achieved "high thermal conductivity of alumina substrates" through via formation technology and printed circuit tec...
- Fine Ceramics
- Circuit board design and manufacturing
- Other electronic parts
In-house pattern design is possible! We also have a track record in CMOS sensor procurement and implementation.
- Circuit board design and manufacturing
Bringing your ideas to life with expert craftsmanship.
- Circuit board design and manufacturing
- Contract manufacturing
We can also accommodate rose parts and reel cut parts! We will respond to your requests, including hand assembly and mounting implementation.
- Circuit board design and manufacturing
Select and propose suitable manufacturers for the project! Procurement is possible not only from domestic but also from overseas PCB manufacturers.
- Circuit board design and manufacturing
Build-up, IVH, high-frequency substrates! We can also propose cost reduction utilizing our design experience.
- Circuit board design and manufacturing
We will respond to the diverse needs of our customers.
- EMS
The clean room class 1000 allows for COG mounting, FOG mounting, polarizer attachment, thermal bonding, and more.
- EMS
We perform design using 3D CAD/CAM, and manufacture molds that support high-precision, high-speed fine processing and high hardness.
- EMS
With the technology of Toho Technology, we solve a variety of problems!
- EMS
- Circuit board design and manufacturing
Enable management and linking for each component, and ensure traceability for surface-mounted components!
- Circuit board design and manufacturing
- EMS
Abolition Notice - We will support you from the 4M change application to mass production!
- Circuit board design and manufacturing
- EMS
Miniaturization of substrates and implementation of fine chip components are possible! For any troubles, come to us!
![0603や1005とは？mm表記とinch表記の違い[1].jpg](https://image.mono.ipros.com/public/product/image_sub/cd8/1447283/IPROS69909631187860803008.jpeg?w=280&h=280){kind=small}
- EMS
Enabling the implementation of high-performance ICs, leading to enhanced functionality and miniaturization of the circuit board!
- Circuit board design and manufacturing
- EMS
We propose the best processing for protecting the substrate (waterproof and dustproof)!
- Circuit board design and manufacturing
- EMS
We have compiled our recommended products along with their specifications!
- Other terminal blocks
- EMS
- Crimp Terminal
We will respond to our customers' needs through collaboration within our group.
- EMS
Even with a 10mm corner, it is possible depending on the processing method! During prototype development, we can process from just one piece.
- Processing Contract
- Circuit board design and manufacturing
- Other semiconductors
Manufacturing high-heat-resistant substrates aimed at thermal conduction and heat dissipation of mounted components!
- Printed Circuit Board
- Circuit board design and manufacturing
Manufacturing high-brightness, high-heat-dissipation PWB for LEDs by combining high-precision processing technology with substrates and plating!
- LED Module
- Printed Circuit Board
- Circuit board design and manufacturing
Directly mounting bear chips on the substrate! A high-density substrate that achieves miniaturization and thinness of devices.
- Circuit board design and manufacturing
- Printed Circuit Board
A semiconductor package that supports miniaturization and high density through unique cavity structure formation technology.
- Other electronic parts
- Circuit board design and manufacturing
- Other semiconductors
We are providing detailed answers to the increasing number of questions regarding "material procurement" in recent years!
- Circuit board design and manufacturing
We support the PSE (Japanese Electrical Appliance and Material Safety Law) business outsourcing for CE-marked products and new products under development.
- Circuit board design and manufacturing
For millimeter wave high-frequency substrates, please contact us for PWB.
- Circuit board design and manufacturing
We can provide simple thermal analysis solutions for issues related to the substrate's "heat."
- Circuit board design and manufacturing
If the standard product doesn't fit, if you would like a different shape, or if there are some processes that cannot be done, please feel free to consult with us! *Q&A materials will be provided.
- Circuit board design and manufacturing
We are offering a technical document that explains thin film processing technology that imparts new functions to materials! It includes various surface treatment and thin film coating methods! We supp...
- Circuit board design and manufacturing
- Other processing machines
Leave your analysis requests to us! Free download of the "Analysis Equipment List"!
The evaluation of thin films is determined by the purpose for which the thin film is used. For example, if the thin film is used for enhancing mechanical strength, important factors for evaluation include hardness and adhesion. If the film is intended to impart optical properties, values such as reflectivity and transmittance become important. Toho Kaken has three main divisions: the "Ion Plating Division," the "Material Analysis Division," and the "Environmental Analysis Center," which allows us to possess a wide range of analytical equipment. In addition to requests for thin film coating, we can also handle analysis and evaluation. We also accept inquiries for "inspection and analysis only" apart from thin film coating, so please feel free to contact us!
4-layer high-density wiring circuit board
- Circuit board design and manufacturing
How do PCB manufacturers track the products of each production?
In the event of a complaint from a customer, the PCB manufacturer must identify the root cause of the problem and take steps to prevent recurrence. However, it is important to have a method to distinguish defective boards from specific production runs. To track each production, the PCB manufacturer affixed a date code and their logo to the PCB substrate. The date code is displayed when the PCB substrate is manufactured. The manufacturer's logo indicates which PCB manufacturer produced the PCB substrate. For example, the date code 2316 indicates that the PCB substrate was manufactured in the 16th week of 2023. Below "EP AB 94 V-0" is the manufacturer's logo. When the PCB manufacturer sees the logo and date code, they can begin root cause analysis by tracking the PCB substrate.
4-layer rigid flex circuit board
- Circuit board design and manufacturing
Is ENIG a substitute for ENEPIG in wire bonding?
Regarding wire bonding, ENEPIG can be considered as the initial option. ENEPIG is regarded as one of the most stable surface finishes for wire bonding, but its production cost is significantly higher compared to other surface finishes. Here, there is a solution to use ENIG with an increased gold thickness of 5u" instead of ENEPIG. Below are the conditions and results of tensile tests demonstrating the performance of ENEPIG and ENIG. Test Conditions: Using T1.0 mil gold wire, the tensile strength should be above 3 grams force (in accordance with TM-650 2.4.42.3). PCB A has an ENEPIG finish with Ni: 200u", Pd: 2u", Au: 2u". PCB B has an ENIG finish with Ni: 200u", Au: 5u". Results: PCB A: 5.091 ~ 11.186 (g) PCB B: 4.432 ~ 12.030 (g) In summary, it can be concluded that both ENEPIG and ENIG are suitable for wire bonding.
It is a composite board of rigid and flexible substrates. Most rigid substrates are multilayer boards.
- Circuit board design and manufacturing
PCB vias filled with epoxy before plating.
You may have heard about the PCB plug process. Why is epoxy resin used to seal the holes in PCBs? What are its advantages and disadvantages? Improved thermal conductivity: Epoxy filling allows for effective heat dissipation within the PCB, which is beneficial for designs with high-power applications or components that generate significant heat. Enhanced signal integrity: Epoxy filling improves the integrity of high-speed signal transmission, reducing signal loss and electromagnetic interference. It minimizes signal reflection and crosstalk, enhancing overall signal quality. Improved electrical insulation: Epoxy filling enhances the electrical insulation between adjacent layers of the PCB, reducing the risk of shorts and ensuring proper insulation between different signal or power domains. While providing these advantages, epoxy-filled holes also come with several challenges. For example, manufacturing may be more costly compared to non-filled holes, and the process may require additional steps and specialized equipment. Additionally, if rework or repairs are necessary, modifying epoxy-filled holes can be difficult. Therefore, the decision to use epoxy-filled holes should consider the specific requirements and constraints of the PCB design and application.
We will support the upcoming high-speed communication standards with PAM4 signal communication boards!
- Communications
- Circuit board design and manufacturing
Generally, high multilayer lamination technology is adopted in manufacturing.
- Circuit board design and manufacturing
Basic Introduction to CCL
CCL is mainly divided into three parts: First, high frequency; next, high speed; and third, ordinary. This classification is primarily based on the following three elements: Df dielectric loss: the loss situation of electrical signals within the material; Dk dielectric constant: the delay situation of electrical signals within the material; Tg glass transition temperature: the heat resistance of CCL. The basic criteria are as follows: Df < 0.005: high frequency; Df between 0.005 and 0.01: high speed; Df > 0.01: ordinary (low speed). Higher-grade CCLs have lower Df/Dk values, resulting in less loss and delay, higher technical requirements, and greater added value. As a result, profit margins and unit prices naturally increase. Further classification results in a total of six parts. Automotive applications are classified as high-frequency CCLs due to their relation to safety, along with 5G. High-speed CCLs are used in servers and switches, while ordinary CCLs are generally used in consumer electronics. The main advantages of high-frequency CCLs are: high efficiency, fast speed, good adjustability, and strong durability. In the manufacturing process, resin, catalyst, and curing agent are first mixed and then applied to glass fiber cloth. This is bonded with PP and covered with copper foil to form the so-called copper foil substrate. In terms of cost ratio, CCL accounts for about 67% of the total PCB cost, and this cost ratio is relatively high.