List of Abrasives products
- classification：Abrasives
2866～2880 item / All 2993 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Apply to low-temperature polishing and resin bond systems.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Diamond wire dedicated micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Irregular green shape, low impact resistance.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Yellow with a regular shape, intermediate crushability.
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Green, block-shaped, with intermediate brittleness and good self-sharpening properties.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Yellow blocky shape with regular crystals.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Reduce thermal shock, prevent oxidation and graphitization, and extend the product's lifespan.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Polycrystalline structure, light green color, irregular shape.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Polycrystalline structure, green blocky shape, intermediate brittleness, and good self-sharpening properties.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Multicrystalline structure, gray, semi-blocky shape.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Reduce high-temperature corrosion and effectively extend the tool's lifespan.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Low-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Ideal for post-CMP cleaning of wafers! Achieves high cleanliness with special cleaning.
- Wafer processing/polishing equipment
- Brush
Mitsui's Technology - Vitrified CBN Diamond Wheel
- Grindstone
Vitrified CBN wheels that achieve overwhelming ultra-high precision machining and long lifespan.
- Grindstone