List of Abrasives products
- classification：Abrasives
2521～2565 item / All 2742 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
As a substitute for general polishing, waterproof paper, cloth paper, and other non-woven fabrics...
- Other abrasives
This is a soft product that is easy to use, made by impregnating non-woven fabric with abrasive material.
- Other abrasives
Ultrasonic finishing device Serap for precision machining that has never existed before!
- Other abrasives
- Other processing machines
We have achieved the production of files using superhard alloy materials.
- Hand polishing and filing
A rich selection to accommodate all types of work!
- Grindstone
- Other abrasives
- others
For over 80 years, we have maintained high quality and continued to be trusted by mold craftsmen.
- Grindstone
- Hand polishing and filing
- Other abrasives
All-purpose abrasive; effective for cost reduction as it is not made of expensive ceramic-based abrasives.
- Grindstone
High-performance, high-efficiency grinding wheels achieve minimal wear and tear through submicron micro-fracturing.
- Grindstone
What about WA + GC? Achieving cool cutting. Prevents grinding burn and reduces corner rounding.
- Grindstone
It has large pores, so it cuts well! The discharge of cutting dust is very good! Large pore grinding wheel.
- Grindstone
Cut cleanly with large pores and increase surface roughness with small pores.
- Grindstone
The roots of porosity theory: It is possible to finely adjust the pores and also to adjust the hardness of the whetstone using the pores.
- Grindstone
The grinding sound is light, soft, and effective for high hardness workpieces, thin materials, and workpieces with low rigidity: "Neo-Hypo-Porous Series."
- Grindstone
Air-permeable resin bond DIA/CBN wheel that has better cutting performance than conventional ones and is less prone to clogging, resulting in extended dress intervals.
- Grindstone
You can understand everything from the grinding sound. Everything will change.
- Grindstone
4-row spiral planting roll brush with drum for conveyor belt cleaner
- Brush
The brush material, thread diameter, and outer diameter can be customized.
- Brush
Use channel guard brushes instead of rubber or sponge!
- Brush
The straight brush firmly secures the hoop and core wire, using a unique method to prevent hair loss.
- Brush
If you are thinking that having a brush like this in this process would be great...
- Brush
From grinding and processing to polishing, deburring, and final finishing. It's a rubber grinding wheel that cuts and polishes.
- Grindstone
A stylish sheet with convenient pockets. You can see the contents and it's easy to take out!
- Office supplies and stationery
- Grindstone
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Colorless synthetic single crystal diamond rough, synthetic diamond rough.
- Diamond cutter
- Other consumables
- Dice
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
No skill or intuition is needed for sharpening round blade cutters! A sharpening machine with easy operation and sharp cutting performance.
- Other machine tools
- Grindstone
No skill or intuition is needed for sharpening round blade cutters! Leave round blade sharpening to this machine.
- Other machine tools
- Grindstone
High capability and top-notch sharpness, making a difference in work efficiency! No skill or intuition required.
- Other machine tools
- Grindstone
Grinding, polishing, and cutting wheels that continue to be long-selling with excellent quality.
- Grindstone
Equipped with thermal stability and wear resistance.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Amber color, regular block structure, medium toughness.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Good dispersion and difficult to crack.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Si Coating (Coating Diamond)
- Grindstone
- Diamond cutter
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
High-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Gray, blocky shape, polycrystalline structure.
- Grindstone
- Other abrasives
- Diamond cutter
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Gray-black color, regular lump shape, high toughness and high thermal stability.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Natural diamond micron powder
- Grindstone
- Other abrasives
- Diamond cutter
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Sub-diamond, micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)