List of Abrasives products
- classification：Abrasives
2611～2655 item / All 2742 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
Irregular green shape, low impact resistance.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Yellow with a regular shape, intermediate crushability.
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Green, block-shaped, with intermediate brittleness and good self-sharpening properties.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Yellow blocky shape with regular crystals.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Reduce thermal shock, prevent oxidation and graphitization, and extend the product's lifespan.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Polycrystalline structure, light green color, irregular shape.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Polycrystalline structure, green blocky shape, intermediate brittleness, and good self-sharpening properties.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Multicrystalline structure, gray, semi-blocky shape.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Reduce high-temperature corrosion and effectively extend the tool's lifespan.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Low-quality diamond micron powder
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Ideal for post-CMP cleaning of wafers! Achieves high cleanliness with special cleaning.
- Wafer processing/polishing equipment
- Brush
Mitsui's Technology - Vitrified CBN Diamond Wheel
- Grindstone
Vitrified CBN wheels that achieve overwhelming ultra-high precision machining and long lifespan.
- Grindstone
Standard CBN wheel series boasting high reliability and proven performance.
- Grindstone
High-performance CBN wheel series that significantly extends tool life.
- Grindstone
A super high-performance CBN wheel that achieves both improved cutting performance and extended lifespan at a high level.
- Grindstone
A series of vitrified CBN wheels that pursue ease of use and cost-effectiveness.
- Grindstone
It is ideal as a manufacturing material for long-lasting and high-efficiency tools.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Plating, surface treatment, diamond electroplating. Just is a professional group specializing in plating.
- Plating Equipment
- Surface treatment contract service
- Diamond cutter
Three types for different applications are lined up as standard products, capable of meeting various site needs.
- Other abrasives
- Hand polishing and filing
We will exhibit at MECT2021 Mechatronics Technology Japan 2021.
We will be exhibiting at the 2021 largest domestic machine tool exhibition held at Port Messe Nagoya (Nagoya International Exhibition Hall). We look forward to your visit. Event Name: Mecatrotech Japan 2021 Dates: October 20 (Wednesday) to October 23 (Saturday), 2021 Opening Hours: 10:00 AM to 5:00 PM On October 22 (Friday), until 6:00 PM; on the final day, October 23 (Saturday), until 4:00 PM Venue: Port Messe Nagoya (Nagoya International Exhibition Hall) Halls 1, 2, and 3 Booth Number: 2D-14 (Hall 2)
This is the comprehensive catalog of original grinding wheels from Toa Seito Kogyo.
- Grindstone
This is a brush that can be shaped into various forms according to its intended use.
- Other machine elements
- Other work tools
- Brush
We introduce a flexible elbow and wire brush that are convenient for piping in narrow spaces.
- Pipe Fittings
- Brush
This is a fitting for narrow space piping and a brush for applying lubricant, convenient for piping in tight areas.
- Pipe Fittings
- Brush
A high-precision finished surface without leaving deep scratches on the workpiece.
- Grindstone
Crystal grinding stones for painting and polishing, created based on charcoal, a natural material.
- Grindstone
A crystal grinding stone for roll grinding that demonstrates incredible polishing power on various materials, achieving a sharp finished surface.
- Grindstone
Can be used for polishing various aluminum and relatively soft metal parts!
- Grindstone
- fiber
Crystal grinding stone for glass and general metal polishing, classified as a relatively hard grinding stone within the crystal grinding stone series, ideal for finishing general metals and glass.
- Grindstone
A special steel grit developed specifically for pre-paint surface preparation. It helps extend the lifespan of steel structures such as shipbuilding and bridges.
- Other metal materials
- Other abrasives
★Good Design Award★ A diamond file that combines unprecedented high functionality and aesthetic beauty, with initial cutting ability more than 3.5 times greater than conventional products.
- Hand polishing and filing
We offer types such as flat, half-round, round, square, triangular, oval, and tapered.
- Hand polishing and filing
We offer types such as flat, half-round, round, square, triangular, oval, and tapered.
- Hand polishing and filing
Durability has increased by 3 to 6 times compared to conventional products! Compatible with materials ranging from soft to hard.
- Hand polishing and filing
Please use for high hardness materials such as ceramics, cemented carbide, and hardened steel.
- Hand polishing and filing
Convenient hard case for portability. Set of 6 with hardness selectable by grip color.
- Hand polishing and filing
- Other measurement, recording and measuring instruments
【Free test grinding in progress!】Experience the high quality of our regrinding.
- Hand polishing and filing
Applicable to machining of cutting tools, wheel correction tools, dies, etc.
- Diamond cutter
- Grindstone
- Hand polishing and filing
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Synthesize under high temperature and high pressure conditions through strict control of temperature and pressure.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
We will contribute to solving your problems through the creation of precise products!
- Grinding Machine
- Diamond cutter
- Other cutting tools