List of CAE products
- classification：CAE
811～855 item / All 3745 items
Equipped with electron microscopes, metal microscopes, and more! We analyze based on accumulated experience.
- Analysis Services
Temperature Control Chamber for Camera System Testing
- Temperature and humidity measuring instruments
- Temperature and Humidity Control
- Other analyses
Turnkey HPC. Flexible options for both location and scale.
- Analysis Services
An open and flexible integrated platform for inclusive model-based development.
- simulator
Composite material property calculation tool (Young's modulus, thermal conductivity, etc.)
- Mechanism Analysis
Comprehensive CAE post-processing and data visualization
- Other analyses
2D/3D CAE - Experimental data analysis and plot creation
- Other analyses
Visual environment for model-based development of embedded systems
- Other analyses
Mathematical formulas, script writing, data analysis, visualization
- Other analyses
Exploration and optimization of powerful design
- Other analyses
Design for efficient metal and resin extrusion molding.
- Other analyses
Topology exploration of electric motors and multiphysics optimization.
- Magnetic field analysis/electromagnetic wave analysis
Accelerate the design of motors, sensors, and actuators.
- Other analyses
Analyze the handling of tasks and machinery to improve work efficiency! Quickly detect falls and accidents! It can be utilized in a wide range of scenes, including production sites, healthcare, and nu...
- Other analyses
Real-time work analysis from video using an AI action analysis system. Aims to improve work processes, efficiency, quality, and safety in production sites.
- Other analyses
It is possible to analyze human behavior and tools/parts in use to improve mistakes, monitor processes, and coordinate alerts for emergencies such as accidents or falls due to dangerous behavior.
- Other analyses
Achieve real-time AI behavior analysis with a small amount of video data. Utilize it to improve on-site operations, prevent accidents, and discover on-site issues through the accumulation of behavior ...
- Other analyses
Aren't you prone to forgetting "Forward, Yosh!"? Let's properly check the "pointing and calling."
- Other analyses
It has become even easier to detect operational mistakes and unsafe behaviors, as well as to utilize it for technical knowledge transfer!
- Other analyses
Are you measuring the correct thermal conductivity of the thermal pad?
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Even thin and small samples, as well as samples with high thermal conductivity, can be measured!
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
Leave the measurement of the thermal conductivity of carbon fiber reinforced plastic (CFRP) to us.
- Thermo-fluid analysis
[Web Seminar for Electronics Manufacturers and Developers] The First Step in Solving Thermal Issues! 'Basics of Thermal Conductivity and Measurement Methods/Measurement Examples'
The "Fundamentals of Thermal Conductivity and Measurement Methods/Case Studies" seminar hosted by Nikkan Kogyo Shimbun will be held soon! In manufacturing and development, thermal issues in electronic devices and materials cannot be avoided. To solve these problems, it is essential to accurately understand the "thermal conductivity" of components and materials and to carry out appropriate thermal design. This seminar will cover the various types of thermal conductive materials used in electronic devices, detailing their measurement methods and specific case studies. By understanding the characteristics and advantages of various thermal conductivity measurement methods, participants will develop the skills to select the optimal method according to the situation. Additionally, actual measurement case studies of thermal conductivity will be introduced, providing knowledge directly applicable to product development and quality control. This seminar is recommended for those who want to acquire advanced thermal property measurement techniques to improve the performance of electronic products and prevent issues. <Knowledge to be Acquired> ◇ Basic knowledge of thermal conductivity ◇ Principles of thermal conductivity measurement instruments ◇ Differences in thermal conductivity measurement methods (which instruments to use for which types of samples) Please click the [Details & Registration] button below to apply.
For the efficiency of product design and development! Analyzing mechanical behavior, including deformation of parts due to load, contributes to reducing prototyping costs and shortening development ti...
- Other analyses
High-precision simulation software recognized by the world.
- simulator
- Solar power generator
- SFA/Sales Support System
Announcement of the Laplace Seminar to be held in January
We invite you to participate in the "Laplace Seminar," a content-rich event that includes a casual Q&A session to introduce our products and solutions. Please join us as a place for information gathering and study. ■ Kyoto Venue <Date and Location> Date: January 24, 2020 (Friday) Venue: Laplace System Co., Ltd. Kyoto Headquarters <Seminar Content> Part 1 (14:30–15:30): Overview of Solar Pro products and new features Part 2 (15:45–16:45): Monitoring and output control, etc. Part 3 (17:00–17:30): Individual consultations
~Press molding simulation software for all tool designers~
- Stress Analysis
The most innovative software for hot/cold forging simulation!
- Other analyses