List of Embedded Systems products
- classification：Embedded Systems
1936～1980 item / All 11494 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
USB Type-C equipped, the smallest and lightest in the series, a box computer the size of two business cards.
- Industrial PCs
- Embedded Board Computers
- controller
New release of the BX-U310 box computer, a compact PC the size of two business cards.
Contec has developed an ultra-compact, fanless embedded computer (the "BX-U310 series" with 8 models) equipped with the Intel Atom(R) Processor x6413E (Elkhart Lake), and will begin accepting orders on June 18, 2024. The new product is a fanless embedded computer featuring the Intel Atom(R) Processor x6413E. Despite its ultra-small design (110mm wide × 80mm deep × 45mm thick), it is equipped with expansion interfaces that can accommodate various applications. It includes HDMI ×1, USB 3.2 Gen 2 ×2, and LAN ×2, and there are also models with built-in wireless LAN, making it ideal for IoT gateway devices and edge computers that connect IT networks and field networks. Additionally, it incorporates many features aimed at industrial usability, such as a fanless wide temperature range design*1 and "Power Cut Protection(R)"*2 that supports operation without the need for shutdown during power interruptions. *1 -10 to +60℃ Airflow 0.7m/s *2 Only for models equipped with M.2 SSD
We will realize a mobility society where all people and things can move seamlessly!
- Embedded system design service
We will establish a consistent production system from planning to art direction and production, providing high-quality solutions.
- Other embedded systems (software and hardware)
- High Speed Camera
One-stop support for in-vehicle ECU development, design, implementation, and SILS/HILS evaluation for autonomous driving and advanced safety systems.
- Embedded system design service
- Other contract services
We provide total support for specification adjustments and software development with related companies in the automotive OEM sector!
- Embedded system design service
- Other contract services
We will realize a mobility society where all people and things can move seamlessly!
- Embedded system design service
- Transport and handling robots
- Other industrial robots
We will flexibly support the development of the development environment for control systems and specifications for automotive OEMs!
- Other contract services
- Embedded system design service
Fast numerical simulations can be achieved through parameter optimization using machine learning!
- Other analyses
- Embedded system design service
- Other information systems
We promote sales through digital marketing utilizing 3DCG! 3D data/CG solutions that can be used on e-commerce sites and websites.
- Other embedded systems (software and hardware)
- Modeler
Three words that I've been hearing a lot lately. A detailed explanation of their differences!
- Other embedded systems (software and hardware)
We provide total support for vehicle software evaluation in a one-stop service!
- Other contract services
- Embedded system design service
- Other industrial robots
We establish a consistent production system from planning to art direction and production, providing high-quality solutions.
- Other embedded systems (software and hardware)
We will exhibit SMART 3D at the DX Comprehensive EXPO 2025 Spring in Tokyo.
From February 26 (Wednesday) to February 28 (Friday), we will be exhibiting SMART3D at the "DX Comprehensive EXPO 2025 Spring Tokyo." We look forward to your visit. - By converting products on the Amazon site to 3D, the purchase rate increases by 1.5 to 3 times! - Created quickly by an Amazon-certified partner. - We can handle everything from estimates to uploads using only the AISIN code (product information), allowing us to update the Amazon site without troubling our customers. *We can also accommodate companies that have their own e-commerce sites. 【Event Overview】 Exhibition Name: DX Comprehensive EXPO 2025 Spring Tokyo Dates: February 26 (Wednesday) / February 28 (Friday), 2025, each day from 10:00 AM to 5:00 PM Participation Method: Pre-registration required (Participation fee: Free) Venue: Makuhari Messe (Hall 6) Booth Location: S18-23
We provide total support for OTA evaluation for automotive OEMs in a one-stop service!
- Other contract services
- Embedded system design service
- Other Auto Parts
A series of processes and function construction necessary for development is possible! Numerous achievements in ECU software development using MBD (Model-Based Development).
- Other contract services
- Embedded system design service
From requirements definition / specification examination / design / implementation / evaluation, there is a track record of handling a series of development processes in embedded development for autom...
- Embedded system design service
- Development support tools (ICE, emulators, debuggers, etc.)
- Other contract services
Contributing to the enhancement of added value in next-generation vehicles through high-quality in-vehicle ECU design and evaluation required for HMI/IVI development.
- Embedded system design service
- Software (middle, driver, security, etc.)
- Development support tools (ICE, emulators, debuggers, etc.)
Analyze voice, text, emotions, and expressions with AI to solve problems! 17 actual use cases in manufacturing, healthcare, sports, and more [Offering a collection of problem-solving examples].
- Development support tools (ICE, emulators, debuggers, etc.)
- EAI/ETL/WEB application server
Analyze and evaluate development data! We support feedback for design. We also implement proposals for improving business workflows!
- Embedded system design service
- Other analysis and evaluation services
- Business Intelligence and Data Analysis
Wide-ranging support for the installation and calibration of ECUs and sensors in vehicles, as well as evaluation of onboard systems!
- Embedded system design service
- Other contract services
- Development support tools (ICE, emulators, debuggers, etc.)
Requirements management and test verification management to ensure traceability and optimize the entire development process.
- Development support tools (ICE, emulators, debuggers, etc.)
- project management
Rapid and reliable large-scale optimization with the solver developed by Stanford Business Software.
- Software (middle, driver, security, etc.)
Next-generation LTE Cat 1 bis communication module SIM7672X series
- Communications
pronoDR has evolved further! Achieving high precision and intuitive VR reviews.
- Software (middle, driver, security, etc.)
Leave your 3D data utilization for manufacturing to Pronoharts.
- Software (middle, driver, security, etc.)
AAEON Industrial COM Express Module equipped with Intel Core Ultra series.
- Embedded Board Computers
AAEON Industrial COM Express Module equipped with Intel Core Ultra series [COM-MTHC6]
Features: ● Equipped with Intel Core Ultra 9 185H / 7 155H / 5 125H processors ● DDR5 5600MHz Dual Channel SODIMM x2 (up to 96GB) (sold separately) ● VGA switch DDI x1, LVDS colay eDP x1, DDI x2 ● USB 2.0 x8, USB 3.2 Gen 2 x4 ● PCIe [x1] x4, PCIe [x4] x1, PEG [x8] + [x4] + [x4] ● 2.5GbE x1 ● DC 9~16V input ● COM Express Type 6, 3.75 inches x 3.75 inches (95mm x 95mm)
Flexible and open, safe, and ready to use! Dynamic content delivery that enhances the value of documents.
- Document and Data Management
- Software (middle, driver, security, etc.)
COM-HPC server type size D module equipped with Intel Xeon D-2700 processor (codename: Ice Lake-D)
- Embedded Board Computers
ADLINK releases edge server class COM-HPC server type and COM Express Type 7 module equipped with the latest Intel Xeon D processor.
- Two new modules for embedded and rugged applications equipped with Intel Xeon D processors (development codename: Ice Lake-D), featuring industrial-grade reliability and extended temperature ratings. - COM-HPC-sIDH server-type module - Express-ID7 Type 7 module - Integrates up to 8 x 10G or other configurations of high-speed Ethernet, combined with up to 32 PCIe Gen4 lanes, achieving instantaneous responsiveness and performance. - Equipped with Intel TCC, Deep Learning Boost (VNNI), and AVX-512, optimizing and accelerating AI performance, supporting TSN (Time Sensitive Networking) for precise control of hard real-time workloads across all devices on the network.
COM-HPC Client Size C module equipped with 13th generation Intel Core desktop processor.
- Embedded Board Computers
ADLINK's COM-HPC module equipped with the 13th generation Intel Core processor offers up to i9, 24 cores, and 36MB cache with a TDP of 65W - enabling innovation across industries with exceptional scalability, I/O bandwidth, and performance per watt.
●Here are the specifications for ADLINK's COM-HPC-cRLS client-type Size C module equipped with the 13th generation Intel Core processor: o Up to 13th generation Intel Core i9 processor, 16 Performance-Cores, 8 Efficient-Cores, and 32 threads o Up to 128GB DDR5 SODIMM at 4000MT/s, and 36MB cache (an increase of 6MB compared to previous models) o PCIe Gen5 x16, 2.5GbE LAN x 2 ●COM-HPC-cRLS supports Intel TCC and Time Sensitive Networking (TSN), making it suitable for hard real-time computing workloads required in applications such as industrial automation, semiconductor equipment testing, and AI robotics.
COM-HPC Server Size E module equipped with Ampere Altra SoC
- Embedded Board Computers
ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
Ampere Altra SoC-based COM-HPC Server Size E reference development platform
- Embedded Board Computers
ADLINK Japan will exhibit at the Arm Tech Symposia Tokyo held on November 7th (Thursday)!
On November 7, 2024 (Thursday), the "Arm Tech Symposia Tokyo" will be held at the Tokyo Conference Center, Shinagawa. This event will feature keynote speeches, panel sessions, and breakout sessions by Arm executives and guest speakers, and ADLINK plans to showcase a variety of Arm-based products. 【Exhibited Products】 OSM Module【OSM-IMX93】 COM-HPC Module【COM-HPC-ALT】 SMARC Module【LEC-IMX95】 Development Kit【I-Pi SMARC IMX8MP】 Development Kit【I-Pi SMARC RB5】 Development Kit【I-Pi SMARC 1200】 IoT Gateway【MXA-200】 Ampere Altra Developer Platform【AADP】
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.