List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

226~240 item / All 5107 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

TAIKO(R) wafer and thin wafer compatible models

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

φ450 (18 inches) jig, equivalent specific gravity and Young's modulus to Si wafers! Low price!

  • Fine Ceramics
  • Other semiconductor manufacturing equipment

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You are using SiC/Si composite materials as the target material.

  • Sputtering Equipment
  • Other metal materials
  • Fine Ceramics

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We provide high-precision SiC ceramic products with a maximum size of 800 x 40t. We will introduce the benefits of adoption through proven results, such as improved device performance and resolution o...

  • Fine Ceramics
  • Other machine elements
  • Other semiconductor manufacturing equipment

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The performance of the device is improved by lightweight, high-rigidity metal-ceramic composite materials.

  • Mounter
  • Other semiconductor manufacturing equipment
  • Other industrial robots

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Inline cleaning of particles on the stage - wafer-type stage cleaner

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment
  • Other cleaning tools

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We will make it possible to regrind tools with small diameters that were difficult to regrind!

  • Wafer processing/polishing equipment

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Perovskite solar cell inkjet simple coating machine

  • Cells and batteries
  • Coater

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Compact ultra-short pulse 50fs laser! A light source for inspection systems of impurities and defects!

  • Semiconductor inspection/test equipment

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Multilayer film formation of sputtered films and evaporated films.

  • Sputtering Equipment

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One Shaft, Two Jobs: Core Clamping and Blade Positioning—Streamlining Setup and Enabling Easy Automation.

  • Bag making machine/slitter
  • Other mounting machines
  • Other semiconductor manufacturing equipment

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By using heat reflection and laser technology, LIT narrows down the heat generation points beneath the metal layer, which were difficult to detect, to as small as 2μm, breaking through the limits of h...

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  • Semiconductor inspection/test equipment
  • Defect Inspection Equipment

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