List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

346~360 item / All 5047 items

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

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  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

Air bearing cylinder with zero friction resistance.

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

Non-contact, high-speed response allows for control as you wish. Custom orders are available starting from one unit!

  • Pneumatic Equipment
  • Bonding Equipment
  • Wafer processing/polishing equipment

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Notice of Participation in the 1st [Kyushu] Semiconductor Industry Exhibition

We will be exhibiting at the "1st [Kyushu] Semiconductor Industry Exhibition" to be held on September 25 (Wednesday) and 26 (Thursday), 2024. On that day, we plan to showcase electronic devices such as remote controls and cables, as well as pneumatic control equipment made by Fujikura Composite, and our self-developed product "Tofmak Non-Stick Coating." We sincerely look forward to your visit. Event Dates: September 25 (Wed) and 26 (Thu), 2024, 10:00 AM to 5:00 PM Venue: Marine Messe Fukuoka, Hall B (Booth Number: 1-19) Organizer: [Kyushu] Semiconductor Industry Exhibition Executive Committee

It is a flip chip bonder capable of high-precision mounting with a tolerance of ±1μm (3σ). Demo tests are available.

  • Bonding Equipment

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Manual flip chip bonder suitable for small-scale production and various experiments.

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  • Bonding Equipment

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Semi-auto FCB (Flip Chip Bonder) that meets a wide range of user needs.

  • Assembly Machine
  • Other semiconductor manufacturing equipment

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A single-layer resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from a high-pressure jet.

  • High pressure cleaner
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

A sheet-type resist stripping and lift-off device with high stripping performance utilizing chemical reactions from heated organic solutions and physical assistance from high-pressure jets [testable].

  • High pressure cleaner
  • Other semiconductor manufacturing equipment
  • Resist Device

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Notice of Participation in Semi-Convention 2020 by Takada Engineering Co., Ltd.

We are pleased to announce that Takada Kogyo Co., Ltd., for which our company, Nissei Co., Ltd., serves as an agent, will be exhibiting at Semicon Virtual 2020. We will be showcasing new products, so please be sure to visit our booth!

We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.

  • Wafer processing/polishing equipment

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Expansion to advanced packages: Processing is possible on a 510×515mm substrate.

  • Sputtering Equipment
  • Etching Equipment
  • Annealing furnace

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I will explain in detail the differences between Teflon and fluoropolymer, which are often confused.

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  • Other semiconductor manufacturing equipment

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I will explain the differences between fluororesin and Teflon.

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  • Other semiconductor manufacturing equipment

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"We want to confirm the effectiveness of the coating in advance." To meet such needs, Yoshida SKT also offers measurements of the coated surface.

  • Resist Device

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[Presentation of Materials] We will introduce the differences in features between Teflon fluoropolymer "PTFE" and "PFA" resins and coatings.

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  • Other semiconductor manufacturing equipment

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Polish with just water! Improve productivity by reducing labor! Remove rust and dirt too!

  • Hand polishing and filing
  • Grindstone
  • Wafer processing/polishing equipment

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100% focus on BATCHSPRAY technology! Significantly reduce water, exhaust, and chemicals [Wet chemical equipment for the semiconductor industry].

  • Other semiconductor manufacturing equipment

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Notice of Participation in SEMICON Japan 2025 (December 17 (Wed) - 19 (Fri), 2025)

Our company will exhibit at "SEMICON Japan 2025," which will be held in December 2025.

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