List of Semiconductor Manufacturing Equipment products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

A blade sharpening machine that realizes various types of sharpening from grass cutting to electric use.

• Wafer processing/polishing equipment
• Other work tools

Variable angle grinding with a focus on detail! Compatible with all sizes of brush cutter blades.

• Wafer processing/polishing equipment
• Other work tools

Easy operation that anyone can use! The standard for chip saw sharpeners.

• Wafer processing/polishing equipment
• Other work tools

Compatible with AA batteries and cigarette lighter power! A chainsaw sharpener that can be used anywhere.

• Wafer processing/polishing equipment
• Other work tools

Easy grinding with a fixed guide! The standard chainsaw sharpener.

• Wafer processing/polishing equipment
• Other work tools

Adjustable angle for visibility! A chainsaw sharpening machine that achieves a wide range of sharpening.

• Other work tools
• Wafer processing/polishing equipment
• others

Crack-free even at 350℃! Dustproof for semiconductor manufacturing equipment and more! Dustproofing is possible with crack-free hard anodizing! Surface treatment and surface modification.

• bolt
• Non-ferrous metals
• Other semiconductor manufacturing equipment

Simultaneous polishing of the outer and inner diameter end faces in a temperature-controlled room! Polished products with minimized dimensional errors.

• Wafer processing/polishing equipment

Horizontal machining of aluminum castings! Capable of handling various shapes with in-house manufactured processing jigs.

• Wafer processing/polishing equipment

Carburizing hardening and polishing processing using steel materials! Capable of buff polishing with excellent surface roughness.

• Wafer processing/polishing equipment

Spindle head with a specification of 30,000 RPM! Demonstrates high precision with coaxiality and perpendicularity of 0.003 millimeters.

• Wafer processing/polishing equipment

Chuck taper grinding using a vertical grinding machine! Achieving high precision with simultaneous internal and external diameter grinding.

• Wafer processing/polishing equipment

Cooling bimetallic joint using S54C and brass! Surface polishing after joining is also possible.

• Wafer processing/polishing equipment

Achieving high machining precision with one chucking! Grinding technology that processes both inner and outer diameters simultaneously.

• Wafer processing/polishing equipment

Active in the automotive and semiconductor industries! Surface grinding processing using a horizontal axis rotary grinding machine.

• Processing Contract
• Other machine elements
• Wafer processing/polishing equipment