List of Semiconductor Manufacturing Equipment products
- classification：Semiconductor Manufacturing Equipment
631～645 item / All 5119 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Introducing a tool grinder for end mills with a diameter of φ4 to 20mm, specifically for sharpening cutting edges!
- drill
- Wafer processing/polishing equipment
Bottom blade 2, 3, 4 blade sharpening! The grinding wheel is a diamond #230 end mill sharpener specifically for carbide.
- drill
- Wafer processing/polishing equipment
A tabletop grinder that allows for easy re-sharpening of end mills without the need to send them out!
- drill
- Wafer processing/polishing equipment
Automatic polishing makes it easy for women, achieving uniform finishing precision! Increases production efficiency, reduces costs, and improves the work environment!
- Other surface treatment equipment
- Wafer processing/polishing equipment
Contributes to reducing tool costs! Easy to polish for anyone, including women and beginners!
- Wafer processing/polishing equipment
- Tap
Thin plate candle for steel frame, compatible with round swing type! Steel frame drill sharpener with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
Grinding range φ3 to 21mm! An automatic drill grinder that can automatically create conical shapes.
- Other surface treatment equipment
- Wafer processing/polishing equipment
Good hole processing is possible! You can regrind the brooch and reduce purchase costs.
- Wafer processing/polishing equipment
Thin plates, candles, and steel frames only! Steel frame drill sharpening machine with a grinding range of φ12.1 to 32mm.
- drill
- Wafer processing/polishing equipment
The grinding stone is CBN #150! A precision end mill grinder capable of sharpening the tip and side edges.
- drill
- Wafer processing/polishing equipment
It is possible to regrind brooches and reduce purchase costs! We offer a lineup of tools such as uneven end mill grinders, cutting machines, and tap grinders!
- Wafer processing/polishing equipment
- Other processing machines
Tabletop small-sized experimental furnace - space-saving with a maximum operating temperature of 2000℃! We also manufacture metal furnaces for reducing atmospheres.
- Heating device
- Electric furnace
- Annealing furnace
4-Yen Multi-Sputtering Device 【MiniLab-S060】
4 cathodes with Φ2 inch configuration Simultaneous film deposition: 3-component simultaneous deposition (RF 500W or DC 850W) + HiPIMS (PulseDC 5KW) x 1 Power distribution and configuration settings for 4 cathodes can be freely changed via the HMI screen using the plasma relay switch 3 MFC systems (Ar, O2, N2) for reactive sputtering RIE etching stage RF 300W (main chamber) + <30W soft etching (LL chamber) Substrate heating: Max 500℃, 800℃, or 1000℃ (C/C or SiC coating) Substrate rotation and vertical movement (automatically controlled by stepping motor) APC automatic control: Upstream (MFC flow adjustment) or downstream (automatic valve opening adjustment on the exhaust side) Dimensions: 1,120(W) x 800(D) ● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
This is a formed bellows for vacuum piping, equipped with JIS standard vacuum flanges.
- Other semiconductor manufacturing equipment
- Vacuum Equipment