List of Semiconductor Manufacturing Equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

Achieves a processing capacity of 72K UPH and high-precision bonding. Supports flip chips and various processes, contributing to improved productivity in semiconductor manufacturing.

• Bonding Equipment

Processing capacity of 60,000 units per hour. Contributes to quality assurance and productivity improvement by performing six-sided inspections of dies without reducing speed.

• Bonding Equipment

Equipped with two chromatic confocal line sensors. Achieves high-speed and high-precision dual-side thickness analysis at 2×384,000 data points per second.

• Bonding Equipment

Achieves high-resolution 3D optical measurement within a maximum range of 350×350mm². Supports extensive surface analysis with six types of sensor technologies.

• Bonding Equipment

Achieving high-speed processing of over 40,000 units per hour and high precision of less than 5μm. Supports multi-faceted assembly such as face-up and flip chip.

• Bonding Equipment

Plasma-resistant diamond

• Etching Equipment

Ion exchange membrane electrolytic cell that achieves both high-purity oxidant production and gas separation.

• Other recycling systems
• Other surface treatment equipment
• Etching Equipment

Selective etching of metals

• Etching Equipment

One unit supports 4 channels! Cost reduction and space-saving possible!

• Other semiconductor manufacturing equipment

HJS K-Series Bellows Pump for Semiconductor Manufacturing Equipment | High Quality, Low Pulsation, High Durability

• Other semiconductor manufacturing equipment

From RF solutions to repair and refurbishment. FNS supports semiconductor manufacturing as a whole.

• Other semiconductor manufacturing equipment