List of Semiconductor Manufacturing Equipment products

  • classification:Semiconductor Manufacturing Equipment

2791~2820 item / All 5068 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

  • Satech - AdaptaGuard_Ipros_2023_JP_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_1.jpg
  • Satech - FastGuard_Ipros_2023_JP_2.jpg
  • Satech - ImpactGuard_Ipros_2023_JP_1.jpg
  • Satech - EasyGuard_Ipros_2023_JP_Media-gallery_1.jpg
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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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You can download a free booklet that introduces the uses, structures, and examples of various types of frames.

  • Other machine tools
  • Solar power generator
  • Other energy equipment

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Compact and rechargeable! Introducing a polisher with excellent workability that makes a difference in polishing!

  • Power tools
  • Hand polishing and filing
  • Wafer processing/polishing equipment

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UV condensing lighting that solves the issues of insufficient uniformity and brightness when inspecting UV adhesives with UV lighting such as rings or bars.

  • Lighting for image processing
  • Semiconductor inspection/test equipment
  • Other optical parts

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We offer sizes ranging from 3.0x3.0mm to 10.0x10.0mm!

  • CVD Equipment
  • others

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We offer a lineup of sizes ranging from 3.0x3.0mm to 10.0x10.0mm!

  • CVD Equipment
  • others

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Mirror surface cutting processing, mirror finishing without wrapping, micro machining, special shapes, arch type, aluminum precision parts for industrial robots.

  • Other semiconductor manufacturing equipment

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An automatic chip regrinding machine with improved safety and workability for shutter opening and closing!

  • Wafer processing/polishing equipment

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Supports φ10 to φ80 and up to 350L! This is the process performed after lathe machining to improve the outer diameter dimensions and surface roughness.

  • Processing Contract
  • others
  • Wafer processing/polishing equipment

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Introducing customizable press devices for various applications such as lamination, bonding, and impregnation!

  • Other semiconductor manufacturing equipment
  • Vacuum Equipment
  • Other mounting machines

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Material A7075 (a7075) ultra-fine machining technology fine groove cutting processing industrial robot aluminum precision parts

  • Other semiconductor manufacturing equipment

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Leave the highly precise metal parts related to optics to us!

  • lens
  • Semiconductor inspection/test equipment
  • Spectroscopic Analysis Equipment

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Polycrystalline silicon is used as a raw material for the semiconductor industry and the solar cell industry (PV). Material: Nickel alloy Process: Filter

  • Sputtering Equipment

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- A wide range of standard-sized products - Easy installation - Precision sintering diffusion bonding (simultaneous sintering) - High flow rate

  • CVD Equipment

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■Advantages ・Custom-made to meet your requirements ・Uniform gas diffusion ・Standard connector elements

  • Sputtering Equipment

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I want to polish like this. Please feel free to consult us about outer diameter polishing, inner diameter polishing, end face polishing, and more.

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing examples of processing rubber rolls made from general-purpose rubber as an alternative to whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a case study of a machined tool holder for SCM415 as an alternative to whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Introducing a processing example using a super finisher that achieved a measurement result of Ra0.035μm, replacing whetstone grinding!

  • Wafer processing/polishing equipment
  • Surface treatment contract service
  • Processing Contract

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Single-item aluminum processing, prototyping, A5052 [Leave cost reduction to Philir Co., Ltd.]

  • Semiconductor inspection/test equipment
  • Other semiconductor manufacturing equipment
  • Resist Device

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[TIG welding] The blue paint is beautiful, part of an assembled product [t1.6]

  • Other semiconductor manufacturing equipment
  • Other machine elements
  • Other machine tools

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Consistent production system from grinding to assembly! We also accommodate small lots.

  • lens
  • Semiconductor inspection/test equipment
  • Optical microscope

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Ultra-fine diameter hole machining technology, fine hole machining technology, small hole machining technology, deep hole machining technology, laser marking.

  • Other semiconductor manufacturing equipment

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Dimension tolerance ±0.05, small diameter hole processing, material A5052 (a5052), aluminum precision parts related to semiconductor manufacturing equipment.

  • Other semiconductor manufacturing equipment

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Flexible multi-stage, diverse, high-efficiency polishing of cylindrical shapes! Film cylindrical super finishing machine with lift and carry transport device included.

  • Wafer processing/polishing equipment

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The world of ultra-fine polishing of the difficult inner surfaces and end faces of cylinders has expanded thanks to the internal unit!

  • Wafer processing/polishing equipment

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Achieving ultra-fine finishing grinding of the outer diameter in recessed areas of the workpiece using a 3D motion W-cross guide method!

  • Wafer processing/polishing equipment

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Film polishing always uses a method of continuously feeding in new film! It flexibly accommodates a variety of roll materials!

  • Wafer processing/polishing equipment

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Powerful performance when mounted on compact general-purpose machines! Unit-type super finisher.

  • Wafer processing/polishing equipment

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Introduction of a film super finishing device with backup roller diameter and width of φ58×50mm!

  • Grinding Machine
  • Wafer processing/polishing equipment

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