List of Mounting Machine products

  • classification:Mounting Machine

421~435 item / All 1925 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
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  • Other safety and hygiene products

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Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...

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  • Shelf life enhancer

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Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.

We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.

Shuttle loader

  • Other conveying machines
  • Hydraulic Equipment
  • Substrate transport device (loader/unloader)

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We will be exhibiting at the Powder & Bulk Solids Tokyo 2012!!!

We will be exhibiting at the International Powder Technology Exhibition Tokyo 2012, POWTEX TOKYO 2012. Booth No: KO1 Exhibits: 1. New Product: Powerful Swirling Flow Conveying - 'Tornado Conveying System' PAT.D Patent obtained for "Method and device for suction powder transportation using spiral airflow." 2. Drum Inversion Suction System Awarded the "Kanagawa Industrial Technology Development Award 2009 - Earth Environment Technology Award." This device can completely discharge powder packaged in polyethylene bags inside a drum without any alteration. It can be automated, making it ideal for handling hazardous powders (toxic, powder explosion) and powders that should not absorb moisture. It allows handling in dry air and N2 (nitrogen gas) environments. Adoption examples: Pharmaceuticals, medical device raw materials, battery materials, abrasives, etc. 3. Continuous and Intermittent Conveying Devices - There is no return from the nozzle due to continuous suction. - Stable conveying can be achieved in dry air and N2 environments. 4. Weighing Machine with Volumetric Feeder - Incremental, Decremental, Loss-in Type - This device can handle difficult powders that cause bridging and rat holes without issues, enabling stable cutting. A series compliant with 'GMP' has been commercialized.

[New Feature] In addition to the conventional CCD cameras, we have added a CCD camera that recognizes and corrects the shape of the product's end face.

  • Circuit board processing machine

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【Automatic PIN insertion and extraction function (one-of-a-kind)】 ■Improvement of dimensional processing accuracy (achieved within ±50μm) ■Streamlining of processes

  • Circuit board processing machine

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Achieving ultra-high precision engraving! ■ Using in-house developed high-precision touch sensors ■ Machining accuracy up to ±0.010mm (conditions negotiable)

  • Circuit board processing machine

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[Stub Remaining Inspection Function] The back drill can inspect all hole counts, making it an effective feature for improving quality control.

  • Circuit board processing machine

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【Example of Inner Layer Copper Foil Engraving】 In semi-flexible substrates, high precision depth accuracy is required from the inner layer copper foil, and we will introduce examples of such processin...

  • Circuit board processing machine

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We are challenging the processing of new substrate materials compatible with high frequency, 5G, and automotive applications, with the cooperation of substrate material manufacturers and substrate man...

  • Circuit board processing machine

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■Detect the target inner layer position and perform back drilling based on that position information. ■Stable processing can be carried out while keeping the minimum stub remaining.

  • Circuit board processing machine

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■ The densification of package substrates is progressing, and there is a demand for miniaturization using CO2 lasers. ■ Introducing examples of miniaturization processing using our VELA machine.

  • Circuit board processing machine

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5G high-frequency compatible products, with APP memory and technologies for thinning and reducing the diameter of the core layer, using CO2 laser drilling techniques for TH holes.

  • Circuit board processing machine

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Focus on the micro-diameter processing capability of CO2 lasers and the technology for controlling resin diameter.

  • Circuit board processing machine

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We are proposing a more reliable laser processing method that leverages the characteristics of both UV lasers and CO2 lasers.

  • Circuit board processing machine

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■High-quality cutting of multilayer substrates using ultra-small diameter beams is possible. ■Not only linear processing but also processing of irregular shapes including curves is possible.

  • Circuit board processing machine

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High-quality blind hole and through hole processing is possible by combining trepanning and punching. Router processing using ultra-small diameter beams is also possible.

  • Circuit board processing machine

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■ Trepanning processing with a diameter of 25um or more is possible using a very small diameter beam. ■ Punching processing with a minimum diameter of 10um is possible only for thin copper foil.

  • Circuit board processing machine

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