List of Polymer Materials products

Electromagnetic wave shielding film processed products for FPC in electronic devices pursuing lightness, compactness, and brevity.

• Other electronic parts
• Processing Contract
• Other polymer materials

This is a flexible epoxy resin of a two-component mixed type with thermal conductivity. It has a thermal conductivity of 1.1 W/mK, flame retardancy equivalent to V-0, and is characterized by crack res...

• Other polymer materials
• Other electronic parts

Low viscosity high thermal conductivity epoxy resin. It is ideal for potting electrical and electronic components that require heat dissipation.

• Other polymer materials
• Other consumables

It is a fast-curing, low-viscosity epoxy resin with high thermal conductivity. Please use it for heat dissipation insulation sealing of electronic devices such as motors, coils, and capacitors.

• Other polymer materials
• Other consumables

This is an epoxy resin recommended for heat dissipation and insulation sealing of motors, coils, capacitors, and more. It offers good workability due to its short curing time and low viscosity.

• Other polymer materials
• Other consumables

Metal-based fillers are dispersed and blended into epoxy resin to achieve high thermal conductivity. This formulation aims to balance high thermal conductivity with usability.

• Other polymer materials
• Other consumables

This is a low-viscosity general-purpose potting resin equivalent to flame retardant UL94 V-0, environmentally friendly. It can cure at room temperature through amine curing.

• Other polymer materials
• Other consumables

It is a two-component epoxy resin that cures at room temperature, has high bending strength (high strength), and low viscosity.

• Other polymer materials
• Other consumables

The general-purpose potting resin is endowed with high thixotropy and low elasticity. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximat...

• Other polymer materials
• Other consumables

General-purpose potting resin with flame retardancy (equivalent to UL94 V-0) and thermal conductivity (1.0 W/mK). It is a high-strength, crack-resistant epoxy resin.

• Other polymer materials
• Other consumables

It is a low viscosity, high strength general-purpose potting resin. Due to the anhydride curing, it is characterized by a long usable time after mixing the two components (approximately 6 to 8 hours).

• Other polymer materials
• Other consumables

This is a general-purpose epoxy potting resin. It is flame-retardant equivalent to V-0 and has a long usable time of 6 to 8 hours after mixing the two components, making it easy to use.

• Other polymer materials
• Other consumables

ANSI Grade G-11 certified heat-resistant class H glass epoxy laminate.

• plastic

Using tape and tabbed separators for temporary adhesion to shorten the process.

• Other electronic parts
• Processing Contract
• plastic

Adopted for the manufacturing of products that support the IT industry, such as insulating plates and machine parts.

• plastic