List of Semiconductors and ICs products
- classification：Semiconductors and ICs
2521～2535 item / All 4821 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Support from product planning to filling, processing, and shipping for additives, cleaning agents, chemicals, deodorizing and disinfecting agents, etc.! For those who have raw materials but no place t...
- Other consumables
- Processing Contract
The world's first cooling water composite treatment agent formulated with "non-chlorine inorganic sterilizing components" developed through Organo's unique manufacturing technology.
- Wafer
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
- Wafer
Reduce prototype development costs and effort!
- Other semiconductors
We provide a comprehensive COF assembly service from mass production to small-scale prototyping, including product development, material procurement, assembly, and electrical characteristic testing.
- Other semiconductors
Implementation of flip chips with bear chips and glass chips.
- Other semiconductors
We will handle mass production testing (CP test / FINAL test) and test development (test programs, boards).
- Wafer
Numerous achievements: Various wafer processing options are available. From bare die shipment to package assembly, you can also choose the shipping method.
- Wafer
For domestic PKG development and OSAT outsourcing, please leave it to Estakaya Electronics Co., Ltd.!
- Memory
Packaging with a special technique! Achieving high functionality!
- Dedicated IC
We will accommodate various stud bump processing according to your specifications.
- Wafer
Consistent support from assembly to imaging inspection at domestic factories! Proven results in various fields such as smartphones, wearables, automotive, and medical.
- Other semiconductors
Supports high-difficulty processing of hard materials! Dicing processing of fragile chips like Low-k wafers can be done without damage.
- Wafer
Packaging with a special technique! Achieving high functionality!
- Dedicated IC
Packaging with a special technique! Achieving high functionality!
- Dedicated IC