List of Semiconductors and ICs products
- classification：Semiconductors and ICs
4201～4215 item / All 4808 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
Ideal for the development of new technologies with cutting-edge plasma treatment for improved wettability, enhanced adhesion, and nano cleaning!
- Other semiconductors
A variety of industrial SSDs and industrial memory cards are available!
- Memory
- SSD
- Storage
We solve various problems from the customer's perspective!
- Other semiconductors
- Printed Circuit Board
- Other electronic parts
- Analysis of the supply and demand for 2 metal COF expected to expand for iPhone -
- Dedicated IC
- plastic
Miniaturized the charging capacitor to 1/10 its size! Furthermore, achieved high efficiency of 95%.
- Charger
- LED Module
- Other semiconductors
Water-free scribe and break method! A technology for cutting hard and brittle materials like glass and ceramics with high quality! Achieving increased productivity with zero kerf loss.
- Wafer
- LCD display
- Fine Ceramics
Information on Exhibiting at CEATEC JAPAN 2016
Samsung Diamond Industrial Co., Ltd. will be exhibiting at the exhibition "CEATEC JAPAN 2016," which will be held at Makuhari Messe from Tuesday, October 4 to Friday, October 7, 2016. Until now, our company has cultivated the technology for breaking brittle materials in the glass substrate and flat panel display markets. This time, we will refine our conventional scribe & break technology for various substrates in new fields such as electronic components and semiconductors, and propose the following new process ("High Speed & Dry") that overturns existing industry concepts. ■ High-quality & high-precision scribing processing with next-generation diamond cutting edges (for ceramics, sapphire, glass, etc.) ■ Chip separation (breaking) processing using V-Motion Separation ■ Scribing/drilling/patterning processing using original laser technology We invite you to visit our booth and experience the new era of scribing & breaking technology. ● Contact Information ● Samsung Diamond Industrial Co., Ltd. EC Business Division, Sales Group TEL: 072-648-5013 FAX: 072-648-5206
Achieved 1% precision head control through inkjet DPN discharge control.
- Other semiconductor manufacturing equipment
- Other process controls
- Other semiconductors