List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

541~555 item / All 4588 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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High-frequency, high-current module contributing to the improvement of EV charging efficiency.

  • diode

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Diode stack for various applications of welding machines.

  • diode

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Diode stack equipped with in-house manufactured devices that supports the safe operation of railways.

  • diode

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Equipped with our own devices! Ideal power supply for laser processing!

  • diode

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If you have challenges with streamlining wet processes or saving space, this is a must-see. We are currently offering materials that introduce an overview of process integration technology.

  • Other semiconductor manufacturing equipment
  • Resist Device
  • Wafer

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Chemical reactions caused by dilute gases can also be considered!

  • CVD Equipment
  • Wafer
  • Other semiconductors

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Blueprint for the PFAS-free era! A thorough explanation of alternative materials and process optimization for each step, from ArF immersion to CMP and cleaning!

  • Technical and Reference Books
  • Other semiconductors

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20260515半導体の進化による接合構造の変化とパッケージング対応.png

5/15 Webinar "Changes in Joint Structures and Packaging Solutions Due to the Evolution of Semiconductors"

■ Title: "Changes in Joint Structures and Packaging Correspondence Due to the Evolution of Semiconductors - Response of Resin Sealing Technology to the Increase in the Number of Joint Locations and Narrow Spacing -" ――Organizing the core of joint design and sealing technology essential for the WLP and 3D assembly era. Covering failure mechanisms and countermeasures associated with high integration, providing insights directly related to development, evaluation, and mass production challenges. ■ Date and Time: May 15, 2026 (Friday) 13:00 - 16:30 ■ Zoom Streaming (with materials) 【Knowledge Gained from the Seminar】 - Development history and trends of semiconductor packaging - Changes in semiconductor joint structures and the current status of packaging technology - Evolution of semiconductor packaging and the development history, challenges, and countermeasures of resin sealing technology 【Target Audience for the Seminar】 - Stakeholders in the semiconductor-related fields (sales, technical positions, etc.) - Individuals interested in semiconductor manufacturing technology (front-end, back-end, etc.) - Those interested in the evolution of semiconductor packaging and the corresponding packaging technology - Individuals interested in semiconductor integration = bonding technology (Bumping Technology)

Aluminum heat sink for board mounting that can secure a transistor without screws (W15 mm x H45 mm)

  • sk703-アルミ押出ヒートシンク-トランジスタ固定スプリング用 (1).jpg
  • sk70350sa.jpg
  • csm_1zeilMag_weiss_E_b78887b03c.jpg
  • Other semiconductors

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Supports chips smaller than 0.3mm! Next-generation manufacturing equipment designed for the miniaturization of electronic components!

  • Wafer

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Achieve high productivity with high-speed pickup technology of up to 10 pcs/sec! Our unique technology ensures reliable packaging of even the smallest chips. *Customizable.

  • Wafer
  • Taping Machine

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Diode stack contributing to power circuits and inverter circuits.

  • diode

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Supports a variety of circuit configurations and a wide range of current ratings.

  • diode

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