List of Semiconductors and ICs products
- classification：Semiconductors and ICs
931～945 item / All 4812 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Strong cold wind from room temperature to -13°C! Depending on the usage environment, you can choose between the combo type or the separate type!
- Cooling system
April 10, 2024 (Wednesday) to April 12, 2024 (Friday) Notice of Participation in Nagoya Manufacturing World 2024
Sanwa Shiki Ventilator Co., Ltd. will be exhibiting at the 2024 Monozukuri World (Nagoya) held at Port Messe Nagoya. We will also be showcasing our large cooling fans and cool/warm ambient products. Date: April 10, 2024 - April 12, 2024 Opening: 10:00 AM Location: Nagoya Port Messe (Exhibition Hall 1) *Our booth: 19-1 We would be grateful if you could visit us if you have the time.
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).
- Vacuum pump
- Vacuum Equipment
- Wafer
July 3 (Wed) - July 5 (Fri) [Exhibition Participation] Announcement of ISSP2024 Corporate Exhibition Corner Participation
The International Symposium on Sputtering and Plasma Processes 2024 (ISSP2024) will be held from July 3 (Wednesday) to July 5 (Friday), 2024, organized by the Surface Vacuum Society. Our company will be exhibiting at the corporate exhibition corner. ■ Exhibition Homepage https://www.issp-jvss.org/ ISSP is an international exhibition focused on sputtering and plasma process technology. This will be the first event in five years since ISSP2019 was held in 2019. Please be sure to stop by our exhibition corner. We will also be holding consultation sessions with our technical staff and demonstrating our developed software, such as Particle-PLUS and DSMC-Neutrals!! We sincerely look forward to your visit.
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors
Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.
- Other semiconductors
You can arrange and secure two transistors to the heat sink.
- Other semiconductors
You can arrange and secure three transistors to the heat sink.
- Other semiconductors
Modular capacitive displacement sensor Easy connection with Ethernet interface!
- Other semiconductors
- Testing Equipment and Devices
A system that makes everything possible with just one device.
- Circuit Board Inspection Equipment
- Wafer
- Testing Equipment and Devices