List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

1321~1335 item / All 4514 items

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Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.

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  • Satech - AdaptaGuard_Ipros_2023_JP_Media-gallery_1.jpg
  • Satech - BlueGuard_Ipros_2023_JP_Media-gallery_2.jpg
  • Other safety and hygiene products

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Amino acid-derived natural cationic polymer that can be used in food preservatives, hygiene materials, and daily necessities. It is a safe material as it is a fermentation product produced by natural ...

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  • Shelf life enhancer

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Introduction of the preservative polylysine / fermented polyamino acids that contribute to food poisoning prevention.

We provide easy-to-understand materials explaining the natural preservative polylysine, which prevents food poisoning. ε-Polylysine (hereafter referred to as polylysine) is an amino acid-derived preservative widely used as a food preservative. By adding polylysine, the growth of microorganisms that cause food poisoning can be prevented. Every year, food poisoning caused by microorganisms is a significant issue and is frequently reported in the news. Even foods that do not appear to be spoiled can rapidly proliferate microorganisms if the growth environment is suitable, so caution is necessary. Even if something looks clean, contamination by bacteria can progress, posing a risk of food poisoning. By ensuring hygiene management during the manufacturing process, proper storage at appropriate temperatures, and the appropriate use of the preservative polylysine, food safety can be more effectively protected. 【Features】 ■ A safe material produced through fermentation by natural microorganisms (not genetically modified organisms) ■ Provides a good image as a natural fermented product ■ Listed in the existing additive registry as a food preservative ■ A safe domestic product *Please feel free to contact us.

Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.

  • Other semiconductors

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A report analyzing industry and market trends, focusing on materials and devices expanding for AI data center applications that can handle the rapidly increasing AI processing.

  • Other semiconductors
  • Database
  • EAI/ETL/WEB application server

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A new style heat sink with lower thermal resistance than the popular FK244 series.

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  • Other semiconductors

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By directly soldering SMT power devices to the circuit board, a heat dissipation effect can be achieved.

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  • fischer-elektronik-フィッシャー-smd-smt-ヒートシンク.jpg
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  • Other semiconductors

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Here is an amazing thermal solution with exceptionally excellent thermal conductivity in the thickness direction of the TIM sheet!

  • Composite Materials
  • Other semiconductors
  • Generators and transmission motors

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We will exhibit at the 2nd Power Device & Module EXPO!

We will be exhibiting at the 39th NePCON Japan (2nd Power Device & Module EXPO). We propose the vertically oriented high thermal conductivity TIM "Zebro." Just applying pressure (surface pressure) brings astonishing thermal management! It has high durability and does not suffer from characteristic degradation due to pump-out or dry-out phenomena. It can be used for a long time with stable low thermal resistance, making it a highly reliable heat dissipation material. For those looking for TIM with good thermal conductivity, or for those struggling with insufficient cooling from conventional heat dissipation materials, we provide thermal management solutions tailored to your needs. We sincerely look forward to your visit!

Heat sink for PCB mounting, 35.3 mm wide x 35 mm high.

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  • Other semiconductors

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Pursuing extremes with rich achievements and advanced technology! Establishing a processing capability system positioned among the world's top class.

  • Other semiconductors
  • Wafer processing/polishing equipment

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An example of connecting different pitches through a pitch conversion adapter linked by a pattern!

  • Other semiconductors

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An adapter composed of a substrate material (CEM-3) that is resistant to high-temperature reflow and pin terminals for SMT implementation!

  • Other semiconductors

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A pin header composed of electrical connection pins and positioning and stacking pins, with a case where the spacer tube has been eliminated.

  • Other semiconductors

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A case where the pin header terminals were shaped in a wave pattern to relieve stress on the solder joint!

  • Other semiconductors

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Attach a horn-shaped hollow terminal to the FPC, solder a lead wire to the hollow terminal, and increase the solder connection area to ensure strength.

  • Other semiconductors

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A case where installation man-hours were reduced with a pin header consolidated into a single base!

  • Other semiconductors

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An example of wire bonding a metal substrate and pin flat part, followed by soldering the metal module substrate to the motherboard.

  • Other semiconductors

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A case where terminal components were directly and automatically inserted onto the circuit board using an insertion machine, reducing labor hours!

  • Other semiconductors

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