List of Semiconductors and ICs products
- classification：Semiconductors and ICs
991～1035 item / All 4838 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
1/1000 micron dimension management! Providing appropriate processing tailored to customer needs.
- Other metal materials
- Other semiconductors
Supports a wide range of materials! Achieving dimension management at 1/1000 microns and short delivery times.
- Other semiconductors
- stainless
In the semiconductor industry! We aim for low cost and high quality to meet our customers' needs.
- Other semiconductors
- aluminum
Manufacturing in Katsushika Ward! We offer products with dimension management of 1/1000 microns in a short delivery time.
- Other semiconductors
- Other metal materials
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Supports a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
Thyristor diode module compatible with a variety of circuit configurations and a wide range of current ratings.
- diode
You can arrange and secure four transistors to the heat sink.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
BGA heat sink with a black anodized surface made of AL6063-T5 aluminum alloy.
- Other semiconductors
Analysis of gas flow under low pressure conditions; analysis software compatible with rarefied gases (rarefied fluids).
- Vacuum pump
- Vacuum Equipment
- Wafer
July 3 (Wed) - July 5 (Fri) [Exhibition Participation] Announcement of ISSP2024 Corporate Exhibition Corner Participation
The International Symposium on Sputtering and Plasma Processes 2024 (ISSP2024) will be held from July 3 (Wednesday) to July 5 (Friday), 2024, organized by the Surface Vacuum Society. Our company will be exhibiting at the corporate exhibition corner. ■ Exhibition Homepage https://www.issp-jvss.org/ ISSP is an international exhibition focused on sputtering and plasma process technology. This will be the first event in five years since ISSP2019 was held in 2019. Please be sure to stop by our exhibition corner. We will also be holding consultation sessions with our technical staff and demonstrating our developed software, such as Particle-PLUS and DSMC-Neutrals!! We sincerely look forward to your visit.
W15 mm x H25 mm Transistor clip compatible aluminum heat sink
- Other semiconductors
Aluminum heat sink for board mounting that can secure a transistor without screws (W20 mm x H50 mm)
- Other semiconductors
Bending processing tailored to usage is also available! It is also possible to combine various functional materials for punching processing.
- Other semiconductors
- Processing Contract
Width 47.8mm Height 33mm Length 50mm Extruded heat sink for PCB mounting Compatible with transistor clips
- Other semiconductors
Aluminum heat sink for mounting on a board, capable of securing a transistor with a clip, measuring 35 mm wide x 30 mm high.
- Other semiconductors
Aluminum heat sink for mounting on a circuit board, capable of securing a transistor with a clip, dimensions 46 mm wide x 33 mm high.
- Other semiconductors
You can arrange and secure two transistors to the heat sink.
- Other semiconductors
You can arrange and secure three transistors to the heat sink.
- Other semiconductors
A system that makes everything possible with just one device.
- Circuit Board Inspection Equipment
- Wafer
- Testing Equipment and Devices
If you're looking for industrial flash memory, choose the large-capacity, low-cost industrial flash memory from UDInfo!
- Memory
Supporting the quality of power semiconductors from the downstream process.
- Other semiconductors
Industry-leading 32-bit MCU Renesas RA family
- Microcomputer
pSLC is a flash memory that combines three features: large capacity, high performance, and low cost!
- Memory
The pSLC technology achieves high performance by innovating control circuits based on MLC, which allows for miniaturization and high integration!
- Memory