List of Semiconductors and ICs products
- classification：Semiconductors and ICs
2116～2160 item / All 4191 items
The latest standard DDR5-4800 SODIMM/UDIMM DRAM modules offer faster performance and are ideal products for a wide range of applications.
- Memory
The XCZU15EG development board is an FPGA board that enables the rapid completion of various applications.
- Other electronic parts
- Other semiconductors
Low-cost experimental and evaluation FPGA board
- Dedicated IC
Hexagon socket bolts, flat screws with a slotted head, etc.! Examples of use, materials, and finishes are also included.
- Other semiconductors
Challenges our company has solved based on trend information! Case studies of solutions found from equipment and manufacturing processes.
- Other semiconductors
NiTi (Nitinol Nickel Titanium) laser welding
- Other semiconductors
- Other semiconductor manufacturing equipment
- Other physicochemical equipment
The definitive version of the ultra-compact vacuum reflow oven!!
- Other semiconductors
Bulk reading of products without moving them using RFID! You can quickly take care of inventory.
- Dedicated IC
- Other services
Prevention of damage from shock and vibration!!
- Wafer
sakase topics No.62
Introduction to the upcoming exhibition We will be exhibiting at the "MEMS Sensing & Network Systems Exhibition" held at Makuhari Messe from October 17 to 19! At the Sakase booth, we will showcase products that can be used as "research and development/production process support tools" for sensors and next-generation MEMS (IoT, AI, automotive, medical), including: - Transport boxes and cases for sensors and MEMS - Transport jigs for inter-process handling If you are nearby, please stop by our booth. Testing with actual products is possible, so take this opportunity to try out any samples you would like to test. For more details, please refer to the attached "Sakase Topics September issue."
Increase productivity and contribute to improved operational efficiency!
- Other semiconductors
sakase topics No.55
This time, we would like to introduce some recommended information about InterNepcon Japan, which was held from January 17 to 19. Thanks to everyone, our booth at this exhibition was a great success. Thank you very much! At the exhibition, we showcased a range of products used for the protection and retention of mounted items, including tack carriers, pin mats, conductive trays and containers for storing tack carriers, and carts for transporting stored items, covering the entire process from protection and retention to storage and transportation. It seemed that many people were particularly interested in the pin mats. For more details, please take a look at the attached "Sakase Topics January issue." ~Announcement~ We have renewed our Tac & Carrier PR video. We aim to deliver content that is clearer and more comprehensive for our customers. You can understand everything about Tac & Carrier in just three minutes. Please take a look! Tac & Carrier special site ⇒ http://www.sakase.com/products/landing/
Achieving the highest level of low noise, high PSRR, low current consumption, and high-speed response performance.
- Other semiconductors
Adopting SiC-MOSFET as the switching element significantly reduces power loss.
- Other semiconductors
The ball diameter is φ5/8" (15.88mm)! Another standard for cleanroom iguchi bearings.
- Other semiconductors
A 2.5-inch SSD equipped with 3D NAND designed for industrial use, capable of supporting large capacities up to 7.6TB, making it an ideal product for a wide range of applications.
- Memory
Definition and Terminology of Industrial SSD Temperature - Part I
When the temperature rises, both physical and chemical processes are accelerated. This is particularly true regarding damage to NAND flash memory cells. In other words, using NAND flash at high temperatures can significantly reduce its durability. Due to its sensitivity to changes in the characteristics of the insulating layer, this effect is more pronounced in high-density flash that stores multiple threshold levels. To maximize the lifespan of NAND flash, the flash memory controller needs to monitor and adapt to these changes. Both variations in ambient temperature and temperature cycles caused by powering the device on and off exert physical stress on the components, as different materials expand and contract at different rates. This can ultimately lead to the failure of electrical connections. For more details, please refer to the related materials! Link: https://www.ipros.jp/news/detail/130425/attachFile/
The adoption results that began from the post-processing of LCDs are now being utilized in various processing stages, and the lineup of positioning stages has also increased.
- Other semiconductors
![[Development Case] Data Recording D...](https://image.mono.ipros.com/public/product/image/d47/2000823019/IPROS15181591032565440259.jpeg?w=280&h=280){kind=small}
A model case that encompasses the overall development, including specifications summary, chassis design, and program design!
- Memory
Due to the dry process, no water is used, making it environmentally friendly. Achieves increased productivity with zero car floss. Compared to conventional methods, it reduces the footprint.
- Wafer
- LCD display
- Fine Ceramics