List of Semiconductors and ICs products

  • classification:Semiconductors and ICs

226~270 item / All 4603 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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Launch of the "Edge-AI Design Academy" training course for LSI designers aimed at the Edge-AI era.

  • Distance learning/E-learning
  • ASIC
  • Other semiconductors

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For cutting and polishing large products such as stone, quartz glass, fireproof bricks, and concrete.

  • Other semiconductors

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A device that changes the "quality" of circulating water and removes scale by performing special electrolysis on the circulating water without using chemical agents.

  • Other semiconductors

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High-performance aluminum structural materials that meet all the needs of FA, from LCD and semiconductor equipment to various industrial machinery.

  • Other semiconductors

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High heat resistance: SX-200 can be used continuously at 400°C! Radiation resistance: over 109 RAD.

  • Other semiconductors

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Further pursuit of lightweight and compact design. The inner diameter of the tube ranges from φ2.5 to φ250, allowing for a wide variety of uses from simple applications to more advanced ones.

  • Other semiconductors

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Equipped with a slow start, slow stop mechanism, speed controller, digital timer minimizer, and a linkage system for automatic spraying devices, etc.

  • Other semiconductors

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We guarantee consistently stable wraps and promise a magnificent mirror finish.

  • Other semiconductors

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Extremely uniform with minimal lot variation.

  • Other semiconductors

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It is a resin that can be cured in a short time by exposing it to ultraviolet light with a wavelength of 200 to 400 nm.

  • Other semiconductors

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PEEK is a thermoplastic super heat-resistant resin that combines excellent mechanical properties and functionality.

  • Other semiconductors

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Excellent corrosion resistance (e.g., hundreds of times that of stainless steel in the case of concentrated hydrochloric acid)

  • Other semiconductors

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It is an abrasive with strong crushing strength and thermal stability.

  • Other semiconductors

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A lineup of 5 types of grain sizes.

  • Other semiconductors

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As of April 1, 2016, the old product name YUPIMORE(R) has been changed to SEPLAS SA.

  • SA101板.jpg
  • SA201板.jpg
  • Other semiconductors

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We have assembled equipment that is strong in the analysis of organic materials such as resin and carbon composites.

  • diode
  • Contract measurement
  • Composite Materials

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hihakai_img.jpg

Announcement of the Start of Non-Destructive Testing Services from April 2018

On April 2, 2018, MST will introduce the latest processing and analysis equipment and begin offering non-destructive analysis services. We will provide analysis services across a wide range of fields, including product development and quality control in electronic devices, pharmaceuticals, and food. Non-destructive analysis is a technology that visualizes the internal condition of a product without destroying it. With the introduction of the latest processing and analysis equipment, MST will now be able to conduct non-destructive analysis. We will offer analysis services on a contract basis.

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You can investigate the changes in degassing intensity while maintaining the temperature.

  • Contract Analysis
  • Memory

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The diffusion layer structure of SiC devices can be visualized (high-sensitivity evaluation of the diffusion layer structure).

  • Contract Analysis
  • Transistor

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The evaluation of the crystal structure can be performed based on the STEM images and the results of atomic composition measurements.

  • Contract Analysis
  • magnet
  • Memory

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Microscopic structural analysis of amorphous films is possible through simulation.

  • Contract Analysis
  • Memory

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It is possible to confirm the stress distribution in the sample cross-section.

  • Contract Analysis
  • Wafer

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It is possible to evaluate trace metals in ppm orders.

  • Contract Analysis
  • Ceramics
  • Wafer

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Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

  • Contract Analysis
  • Transistor
  • Power storage device

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Non-destructive three-dimensional observation of the internal structure of a discrete package.

  • サンプル内部構造.png
  • サンプル全景.png
  • サンプル外観.png
  • X線透過像.png
  • 開封後のサンプル内部構造.png
  • Contract Analysis
  • Other semiconductors

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Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

  • Contract Analysis
  • Other semiconductors

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Evaluation of microscopic atomic structures is possible through computational simulation.

  • Contract Analysis
  • Other semiconductors

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Reverse engineering of DRAM on the product's internal substrate.

  • Contract Analysis
  • Memory

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It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.

  • Contract Analysis
  • Memory

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It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

  • img_C0264_2.jpg
  • img_C0264_3_HO-Si-O.jpg
  • img_C0264_4_O-Si-O-Si-O.jpg
  • img_C0264_5_Si-N-Si.jpg
  • img_C0264_6_Si-Si.jpg
  • Contract measurement
  • Transistor
  • Memory

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Simultaneous measurement of inorganic and organic components in minute specific areas.

  • img_C0034_4.jpg
  • img_C0034_5.jpg
  • img_C0034_6.jpg
  • Contract measurement
  • Wafer
  • Memory

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We evaluate abnormalities inside the device non-destructively.

  • Contract Analysis
  • Other electronic parts
  • Transistor

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Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

  • img_c0638_2.jpg
  • Wafer
  • Contract measurement
  • Other semiconductors

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Shape observation and simple quantitative analysis using SEM-EDX.

  • img_C0736_2.jpg
  • Contract Inspection
  • Wafer
  • Other semiconductor manufacturing equipment

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It is effective to differentiate between the two methods depending on the surface structure of interest.

  • Contract Analysis
  • Memory

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High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.

  • Contract Analysis
  • Wafer
  • Water quality testing

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It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).

  • img_C0743_3.jpg
  • Contract Analysis
  • Other electronic parts
  • Memory

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From semiconductor and LCD manufacturing equipment parts to nursing and welfare equipment parts. MINWA delivers high-precision and high-quality machining.

  • Other semiconductors
  • LCD display
  • Other machine elements

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