List of Semiconductors and ICs products

Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

• air conditioning

Microscopic structural analysis of amorphous films is possible through simulation.

• Contract Analysis
• Memory

It is possible to confirm the stress distribution in the sample cross-section.

• Contract Analysis
• Wafer

It is possible to evaluate trace metals in ppm orders.

• Contract Analysis
• Ceramics
• Wafer

Evaluation of functional groups in graphene is possible using thermal decomposition GC/MS method.

• Contract Analysis
• Transistor
• Power storage device

Non-destructive three-dimensional observation of the internal structure of a discrete package.

• Contract Analysis
• Other semiconductors

Quantitative evaluation of the roughness of trench sidewalls related to device characteristics.

• Contract Analysis
• Other semiconductors

Evaluation of microscopic atomic structures is possible through computational simulation.

• Contract Analysis
• Other semiconductors

Reverse engineering of DRAM on the product's internal substrate.

• Contract Analysis
• Memory

It is possible to obtain insights into the size and distribution of crystal grains in metallic polycrystals.

• Contract Analysis
• Memory

It is possible to capture molecular information of inorganic substances in the depth direction using TOF-SIMS.

• Contract measurement
• Transistor
• Memory

Simultaneous measurement of inorganic and organic components in minute specific areas.

• Contract measurement
• Wafer
• Memory

We evaluate abnormalities inside the device non-destructively.

• Contract Analysis
• Other electronic parts
• Transistor

Impurities in films and interfaces such as plating can be evaluated using TOF-SIMS.

• Wafer
• Contract measurement
• Other semiconductors

Shape observation and simple quantitative analysis using SEM-EDX.

• Contract Inspection
• Wafer
• Other semiconductor manufacturing equipment

It is effective to differentiate between the two methods depending on the surface structure of interest.

• Contract Analysis
• Memory

High-sensitivity analysis of various solutions, such as pure water and wafer cleaning liquids, is possible.

• Contract Analysis
• Wafer
• Water quality testing

It is possible to evaluate the competitive adsorption of multiple molecules using the focus parameters for film formation (temperature, pressure).

• Contract Analysis
• Other electronic parts
• Memory

From semiconductor and LCD manufacturing equipment parts to nursing and welfare equipment parts. MINWA delivers high-precision and high-quality machining.

• Other semiconductors
• LCD display
• Other machine elements

Hybrid sintering die attach adhesive as a replacement for lead solder and epoxy adhesive.

• Dedicated IC

The introduction of the laminated substrate reduces the degradation of the forward characteristics of the body diode!

• diode

The encapsulating materials for advanced semiconductor packages require various characteristics such as low stress, moisture resistance, and high reliability. Guidelines for the design and evaluation ...

• Other semiconductors
• Engineering Plastics
• Technical Seminar

A systematic explanation from the basics of semiconductor packaging to the design and evaluation of encapsulation materials. Leading experts thoroughly organize practical perspectives from WLP/PLP to ...

• Other semiconductor manufacturing equipment
• Other semiconductors
• Technical Seminar

Achieve high current while minimizing losses during implementation with Power PKG (HSOP8)!

• Transistor

Liquid hazardous materials can also be safely transported with all-fiber solutions.

• Wafer
• Resist Device
• Photomask

For thermal management of medium-sized devices. You can specify the ideal length in 1mm increments, without being constrained by the fixed sizes in the catalog, to match the enclosure space.

• Other semiconductors

Knowledge of gain chips useful for research and development. Explanation of features, mechanisms, and how to choose.

• diode

Not constrained by fixed catalog sizes. You can specify the ideal length in millimeters to match thermal design and enclosure space. Additional processing can also be handled in bulk!

• Other semiconductors

I will explain the structure, features, and key points of the application of VCSELs.

• diode

Looking for the appropriate PD. An explanation of the types of photodiodes and their structural characteristics!

• diode

Pin fin heat sink, width 40mm, height 20mm, length 40mm, material: Al99.5.

• Other semiconductors

Square pin fin heat sink, width 50mm, height 25mm, length 50mm, material: Al99.5.

• Other semiconductors