List of Grindstone products

  • classification:Grindstone

541~555 item / All 649 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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Gray, blocky shape, polycrystalline structure.

  • Grindstone
  • Other abrasives
  • Diamond cutter

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Notice of participation in GrindTec 2016.

We understand that you are busy, but we sincerely request your attendance. Event Name: Germany Grindtec 2016 Exhibition Date: March 16 (Wednesday) to March 19 (Saturday), 2016 Time: 9:00 AM to 5:00 PM Booth Number: 2077 (Hall 2)

Gray-black color, regular lump shape, high toughness and high thermal stability.

  • Diamond cutter
  • Grindstone
  • Other abrasives

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20160229113634561.jpg

Notice of participation in GrindTec 2016.

We understand that you are busy, but we sincerely request your attendance. Event Name: Germany Grindtec 2016 Exhibition Date: March 16 (Wednesday) to March 19 (Saturday), 2016 Time: 9:00 AM to 5:00 PM Booth Number: 2077 (Hall 2)

Natural diamond micron powder

  • Grindstone
  • Other abrasives
  • Diamond cutter

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Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

Sub-diamond, micron powder

  • Diamond cutter
  • Grindstone
  • Other abrasives

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semijapan.png

Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

Introducing the cutting wheels and grinding wheels from Germany's Feiad company.

  • Grindstone

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For fiber grinding stones, abrasives, and high-performance FRP, leave it to Sowaka Kasei.

  • Grindstone
  • Diamond cutter
  • Power tools

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A stunning cut surface! This cutting wheel is ideal for fine cutting of difficult-to-machine materials.

  • Grindstone

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Notice of participation in the 2016 Xiamen International Stone Fair.

We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069

Absorbing the benefits of diamonds and WC, it possesses high wear resistance and excellent impact strength.

  • Diamond cutter
  • Grindstone
  • Other abrasives

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20160222035147391.jpg

Notice of participation in the 2016 Xiamen International Stone Fair.

We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069

It is optimal for processing cutting tools made of high-hardness ferrous and non-ferrous metals.

  • Other cutting tools
  • Grindstone
  • Other consumables

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semijapan.png

Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

Applicable to milling bits and oil drilling bits.

  • Diamond cutter
  • Grindstone
  • Other abrasives

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20160222035147391.jpg

Notice of participation in the 2016 Xiamen International Stone Fair.

We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069

Diamond slurry, suspension, CBN paste

  • Grindstone
  • Other abrasives
  • Diamond cutter

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semijapan.png

Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

Diamond slurry, suspension, paste

  • Grindstone
  • Other abrasives
  • Diamond cutter

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semijapan.png

Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

Diamond slurry, suspension

  • Grindstone
  • Other abrasives
  • Diamond cutter

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semijapan.png

Notice of Participation in SEMICON Japan 2015

ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)

There are two types: electrophoretic coating and chemical coating.

  • Diamond cutter
  • Grindstone
  • Other abrasives

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20160222035147391.jpg

Notice of participation in the 2016 Xiamen International Stone Fair.

We plan to exhibit at the Xiamen International Stone Fair 2016. We understand you are busy, but we sincerely hope you can attend. Name: Xiamen International Stone Fair 2016 Dates: March 6 (Sunday) to March 9 (Wednesday), 2016 Time: 9:00 AM to 5:30 PM Venue: China Xiamen International Conference and Exhibition Center Booth Number: 5069

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