List of Other abrasives products
- classification：Other abrasives
1321～1335 item / All 1422 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
We will introduce Murako's extensive range of polishing products that meet various needs and scenes.
- Other abrasives
No need for sharpening! A tool that achieves easy trimming by simply setting it in the holder.
- Other abrasives
Comprehensive catalog of grinding stones and polishing supplies for molds. A wide variety of products to accommodate all types of work.
- Grindstone
- Hand polishing and filing
- Other abrasives
As a substitute for general polishing, waterproof paper, cloth paper, and other non-woven fabrics...
- Other abrasives
This is a soft product that is easy to use, made by impregnating non-woven fabric with abrasive material.
- Other abrasives
Ultrasonic finishing device Serap for precision machining that has never existed before!
- Other abrasives
- Other processing machines
A rich selection to accommodate all types of work!
- Grindstone
- Other abrasives
- others
For over 80 years, we have maintained high quality and continued to be trusted by mold craftsmen.
- Grindstone
- Hand polishing and filing
- Other abrasives
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Towards environmental conservation and further customer benefits. We propose 21st-century polishing.
- Other abrasives
- Wafer processing/polishing equipment
Equipped with thermal stability and wear resistance.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Amber color, regular block structure, medium toughness.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of participation in GrindTec 2016.
We understand that you are busy, but we sincerely request your attendance. Event Name: Germany Grindtec 2016 Exhibition Date: March 16 (Wednesday) to March 19 (Saturday), 2016 Time: 9:00 AM to 5:00 PM Booth Number: 2077 (Hall 2)
Good dispersion and difficult to crack.
- Diamond cutter
- Grindstone
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)
Si Coating (Coating Diamond)
- Grindstone
- Diamond cutter
- Other abrasives
Notice of Participation in SEMICON Japan 2015
ZZDM will be exhibiting at SEMICON Japan 2015, which will be held at Tokyo Big Sight from Wednesday, December 16 to Friday, December 18. This year, we plan to introduce diamond powder for polishing related to semiconductors such as sapphire, SiC, GaN, and Si, diamond powder specifically for diamond wire, and diamond powder for precision blades/wheels. We sincerely look forward to your visit at the ZZDM booth (2220). Location: Tokyo Big Sight, East Exhibition Hall and Conference Hall Date and Time: Wednesday, December 16 to Friday, December 18, 2015, from 10:00 AM to 5:00 PM Admission Fee: Free (pre-registration required)