List of Embedded Board Computers products
- classification：Embedded Board Computers
331～345 item / All 3610 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280){kind=small}
NXP/i.MX6 equipped SMARC short-size module
- Embedded Board Computers
The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280){kind=small}
NXP i.MX95 equipped SMARC 2.1 short-size module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280){kind=small}
SMARC short-size module equipped with MediaTek Genio 1200 platform.
- Embedded Board Computers
ADLINK has released an AIoT SMARC module featuring the MediaTek SoC, equipped with an 8-core CPU and a 5-core GPU, known as the Genio 1200.
●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Jetway Arrow Lake-S compatible H810 chipset LGA1851 socket Mini-ITX board
- Embedded Board Computers
Jetway Arrow Lake-S compatible W880 chipset LGA1851 socket Mini-ITX board
- Embedded Board Computers
Jetway Arrow Lake-S compatible Mini-ITX board with Q870 chipset and LGA1851 socket.
- Embedded Board Computers
AAEON 3.5-inch standard single-board computer
- Embedded Board Computers
AAEON 3.5-inch standard single board computer equipped with Core 3 N355/N150.
Features: ●Core 3 N355/N150 ●DDR5 SODIMM x 1 (up to 16GB) ●HDMI 1.4, VGA, LVDS ●2.5GbE x 3, SATA 6Gb/s, GPIO 8-bit ●USB 3.2 Gen 2 x 2, RS-232/422/485 x 2, RS-232 x 2 ●Mini PCIe x 1, M.2 2230 E-Key x 1, M.2 3052 B-Key x 1 ●DC input 9V～36V
Jetway 12th/13th/14th generation Core i class compatible industrial fanless compact PC with expansion slots.
- Embedded Board Computers
Jetway 12th/13th/14th Generation CPU Compatible Chipset H610 Industrial Fanless Compact PC
- Embedded Board Computers
Jetway Arrow Lake-S compatible LGA1851 socket Q870 industrial ATX standard motherboard
- Embedded Board Computers