List of Embedded Board Computers products

  • classification:Embedded Board Computers

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For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.

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  • Work gloves

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Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.

Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.

AAEON COM Express Type 10 module equipped with Core Ultra 7 155H / 5 125H.

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  • Embedded Board Computers

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AAEON COM Express Type 10 module equipped with Core Ultra 7 155H / 5 125H【NANOCOM-MTU】

Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)

AAEON Intel Core Ultra7 255H/5 225H equipped 3.5-inch standard industrial CPU board

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  • Embedded Board Computers
  • Expansion Boards

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AAEON Intel Core Ultra7 255H/5 225H equipped 3.5-inch standard industrial CPU board [GENE-ARH6]

Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.

Just replace it with the standard product.

  • Other electronic parts
  • Embedded Board Computers
  • Development support tools (ICE, emulators, debuggers, etc.)

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AMD Embedded Ryzen V3000 equipped COM Express Rev.3.1 Basic Type 7 module

  • Embedded Board Computers

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ADLINK Japan will exhibit at the "AMD Adaptive & Embedded Computing Tech Day Tokyo" held on September 19 (Friday)!

The event hosted by AMD is a technology conference that showcases the latest products and solutions featuring AMD technology. Through presentations by experts and interactive demonstrations, AMD's initiatives that lead cutting-edge technological trends in a wide range of fields such as manufacturing, AI, robotics, healthcare, automotive, aerospace, and defense will be introduced. There will also be opportunities for direct interaction with industry experts. The content is designed to provide an optimal opportunity for those involved in design and development to deepen their understanding of efficient application development using AMD's platforms and gain new insights. ADLINK is scheduled to showcase the latest AMD-based computer-on-modules, the "Type 6 Compact Module cExpress-R8" and the "Type 7 Basic Module Express-VR7." We look forward to your visit.

COM Express Type 6 Compact with AMD Ryzen Embedded 8000 series processor

  • Embedded Board Computers

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ADLINK Japan will exhibit at the "Advancing AI 2025 Japan" event hosted by AMD on December 3rd (Wednesday)!

The event hosted by AMD is a technology conference showcasing the latest products and solutions featuring AMD technology. AMD is holding this event with the aim of accelerating "trust" in AI together with its business partners and end users. ADLINK plans to exhibit its latest AMD-powered computer-on-module. ●Type 6 Compact module "cExpress-R8"

VECOW, equipped with 15th generation i9/i7/i5/i3 CPU (Bartlett Lake-S), expansion temperature -40 to 60°C

  • Image Processing Equipment
  • Embedded Board Computers

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Intel Amston Lake ATOM x7000RE series equipped 2.5+ inch SBC

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  • Embedded Board Computers

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AMD Ryzen Embedded 8000 equipped COM Express Compact Module Type 6

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  • Embedded Board Computers
  • Industrial PCs

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Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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Introducing the "i.MX 8M Plus SMARC SOM" that we handle!

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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Support for multi-OS platforms! Over 10 years of product lifespan program.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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High AI inference performance with industrial-grade availability! Over 10 years of long-term support.

  • Industrial PCs
  • Embedded Board Computers
  • Embedded OS

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Compact, low power consumption, TI, SMARC

  • Industrial PCs
  • Embedded Board Computers

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Compact, low power consumption 1, imx6, SMARC

  • Industrial PCs
  • Embedded Board Computers

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Compact, low power consumption, SMARC, imx8m

  • Embedded Board Computers
  • Industrial PCs

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