List of Embedded Board Computers products
- classification：Embedded Board Computers
46～60 item / All 3978 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
NVIDIA RTX ADA 3500 built-in MXM GPU module
- Embedded Board Computers
3.5-inch single-board computer equipped with Intel Core Ultra processor
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
3.5-inch single board computer equipped with Intel x7835RE/x7433RE/x7211RE processors
- Embedded Board Computers
ADLINK releases a new 3.5-inch single-board computer for scalable edge AI and robust embedded applications.
●3.5 "Expanding the SBC Portfolio: ADLINK has announced the SBC35-MTL and SBC35-ASL, targeting both high-performance AI and robust embedded edge applications. ●AI Compatibility and Robust Design: The SBC35-MTL is equipped with an Intel Core Ultra featuring an NPU for real-time inference, while the SBC35-ASL is powered by the Intel Atom x7000RE, providing a wide temperature range and fanless operation. ●Flexible I/O with SBC-FM Modules: Both models support ADLINK's SBC-FM expansion modules, enabling customized I/O to accelerate deployment across various industries.
Wide voltage Mini-ITX supporting H610 chipset and 14th/13th/12th generation Intel Core CPUs.
- Embedded Board Computers
ADLINK releases wide voltage compatible Mini-ITX motherboards for industrial embedded applications.
●Wide voltage input: Supports 12-28V DC input, ensuring stable operation even in environments with unstable power. ●Balanced performance: Supports Intel Core CPUs with a maximum of 65W using PCIe 4.0, DDR4, and dual 2.5GbE. ●Ideal design for industrial applications: The Mini-ITX form factor and rich expandability enable seamless integration into embedded systems.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
SMARC short-size module equipped with NXP i.MX 8M Mini SoC
- Embedded Board Computers
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Autonomous Driving AI Decision-Making Controller (ECU)
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
Scalable T2G onboard gateway
- Embedded Board Computers
ADLINK's 7 products won the 2026 Taiwan Excellence Award, showcasing outstanding research and development innovation leadership.
●ADLINK wins 7 products at the 34th Taiwan Excellence Awards: This demonstrates the company's advanced research and development capabilities in edge AI computing and intelligent applications. The award-winning products span industrial computers, AI platforms, and medical and transportation solutions, showcasing the company's comprehensive innovation strength. ●AI drives smart industries and accelerates modular innovation: Products such as the EMP-520, SP2-MTL, and Ampere Altra Dev Kit leverage high-performance AI inference and modular design to help companies expedite the adoption of smart manufacturing and automation applications. ●New milestones in smart transportation and medical applications: The ADM-AL30, AVA series, and MLC-S medical panel PC provide highly stable AI computing and robust security protection in autonomous driving, railways, and clinical medical environments, realizing a reliable intelligent ecosystem.
CEB server board equipped with Intel Xeon 600 processors for workstations.
- server
- Embedded Board Computers
ADLINK releases next-generation server boards equipped with Intel Xeon 600 processors for workstations and 2U/4U edge AI servers.
● Comprehensive portfolio expansion: ADLINK has introduced the Intel Xeon 6 series for workstations. This lineup, which includes the ISB-W890 board and AXE GPU server, enables the expansion of edge AI from traditional workloads to real-time generative AI and advanced analytics. ● Versatile high-performance architecture: A lineup designed for compute-intensive tasks such as intelligent automation and large-scale visual processing, ranging from flexible CEB server boards to 2U/4U GPU servers. ● Rapid deployment: Streamlines the transition from AI development to full-scale edge deployment with mission-critical reliability, reducing time to market.
Value Family 9th Generation Intel Xeon/Core i7/i5/i3 Processor Equipped Expandable Edge GPU Computer
- Industrial PCs
- Embedded Board Computers
A must-see for those interested in the deployment of edge AI! ADLINK will be presenting at GTC 21 (April 12-16)!
Artificial Intelligence (AI) heralds the arrival of a new era in computing, enabling greater innovation, productivity, and cost reduction. For edge applications where time and safety are critical, such as medical imaging and industrial-grade intelligent video analysis, edge AI solutions can better meet the stringent response times than cloud AI. By attending ADLINK's on-demand session at the NVIDIA GPU Technology Conference (GTC) held online from April 12 (Monday) to April 16 (Friday), 2021, you can learn how to accelerate edge AI development. - You will learn how edge AI is advancing medical and industrial applications. - You will gain insights into overcoming the challenges of edge AI. - You will hear about AI models and tools for video analysis. *Please note that ADLINK's session will be in English.
Mini-ITX embedded board equipped with 8th/9th generation Intel Core desktop processor.
- Embedded Board Computers
NVIDIA RTX A1000 built-in mobile PCI Express module
- Embedded Board Computers
ADLINK releases the first embedded MXM graphics module featuring the NVIDIA Ampere architecture for edge computing and AI.
● ADLINK's EGX-MXM-A1000, EGX-MXM-A2000, and EGX-MXM-A4500 are the first modules to adopt NVIDIA's embedded GPU based on the NVIDIA Ampere architecture. ● ADLINK's MXM graphics modules provide high-performance GPU acceleration in a compact and power-efficient MXM form factor, bringing edge computing and embedded AI to many vertical markets such as healthcare, manufacturing, and transportation. ● Robust design that withstands harsh temperature environments, shock, vibration, and corrosion under severe conditions.