List of Embedded Board Computers products
- classification：Embedded Board Computers
946～960 item / All 3833 items
Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.
- air conditioning
Compact, space-saving half business card size embedded DSP board, 456MHz high-performance DSP board [custom specifications available]. Please inquire.
- Embedded Board Computers
Compact size COM Express Type 6 module equipped with Pentium and Celeron.
- Embedded Board Computers
Released IoT solutions for mobility, healthcare, and industrial automation equipped with Intel Atom x5-E8000 processors.
The release of four embedded computing solutions featuring the Intel Atom x5-E8000 processor has been announced. The Intel Atom processor, built on 14 nm technology, helps improve performance for mobility, medical, and industrial automation applications while reducing power consumption. The latest COM Express cExpress-BW, SMARC LEC-BW, Qseven Q7-BW modules, and the K's AmITX-BW-I Mini-ITX embedded board have been enhanced in computational performance, allowing for a better price/performance ratio.
GIGAIPC PICO-ITX standard single board computer equipped with Intel Atom x7433RE.
- Embedded Board Computers
GIGAIPC Mini-ITX Standard Industrial Motherboard 15th Generation LGA1851 Socket H810E ATX Power Supply Compatible
- Embedded Board Computers
AAEON COM Express Type 10 module equipped with Core Ultra 7 155H / 5 125H.
- Embedded Board Computers
AAEON COM Express Type 10 module equipped with Core Ultra 7 155H / 5 125H【NANOCOM-MTU】
Features: ● Equipped with Intel Core Ultra 5 125H/7 155H ● LPDDR5 16GB onboard memory ● NVMe 128GB onboard storage ● eDP x 1, DDI x 1 ● USB 2.0 x 8, USB 3.2 Gen2 x 2 ● PCIe 4.0[x1] x 4 ● 2.5GbE x 1 ● COMe Type10 standard, size 84mm x 55mm ● Optional items ECB-920A-0001: Development carrier board NANOCOM-MTU-FAN: CPU fan NANOCOM-MTU-HSP: Heat spreader (Note: Heat dissipation is required in the enclosure)
AAEON Intel Core Ultra7 255H/5 225H equipped 3.5-inch standard industrial CPU board
- Embedded Board Computers
- Expansion Boards
AAEON Intel Core Ultra7 255H/5 225H equipped 3.5-inch standard industrial CPU board [GENE-ARH6]
Features: ● Equipped with Intel Core Ultra 5 225H/7 255H (Arrow Lake) ● DDR5 6400MHz dual-channel SODIMM x 2 (up to 96GB) (sold separately) ● LVDS x 1, eDP x 1, HDMI x 1 ● LAN x 3, SATA 6Gb/s x 1, 8-bit GPIO ● USB 3.2 Gen2 x 2, USB 2.0 x 4 ● M.2 2280 M-key x 1, M.2 3052 B-key x 1, M.2 2230 E-key x 1 ● Supports DC input of 9 to 36V ● Fan-equipped heat sink available separately GENE-MTH6-FAN: Heat sink with fan GENE-MTH6-HSP: Heat spreader (requires heat dissipation in the enclosure) * This model does not include OS/memory/storage.
Just replace it with the standard product.
- Other electronic parts
- Embedded Board Computers
- Development support tools (ICE, emulators, debuggers, etc.)
AMD Embedded Ryzen V3000 equipped COM Express Rev.3.1 Basic Type 7 module
- Embedded Board Computers
ADLINK Japan will exhibit at the "AMD Adaptive & Embedded Computing Tech Day Tokyo" held on September 19 (Friday)!
The event hosted by AMD is a technology conference that showcases the latest products and solutions featuring AMD technology. Through presentations by experts and interactive demonstrations, AMD's initiatives that lead cutting-edge technological trends in a wide range of fields such as manufacturing, AI, robotics, healthcare, automotive, aerospace, and defense will be introduced. There will also be opportunities for direct interaction with industry experts. The content is designed to provide an optimal opportunity for those involved in design and development to deepen their understanding of efficient application development using AMD's platforms and gain new insights. ADLINK is scheduled to showcase the latest AMD-based computer-on-modules, the "Type 6 Compact Module cExpress-R8" and the "Type 7 Basic Module Express-VR7." We look forward to your visit.
COM Express Type 6 Compact with AMD Ryzen Embedded 8000 series processor
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
VECOW, equipped with 15th generation i9/i7/i5/i3 CPU (Bartlett Lake-S), expansion temperature -40 to 60°C
- Image Processing Equipment
- Embedded Board Computers
AMD Ryzen Embedded 8000 equipped COM Express Compact Module Type 6
- Embedded Board Computers
- Industrial PCs
Equipped with Bluetooth 5.0! Over 10 years of product lifespan program.
- Industrial PCs
- Embedded Board Computers
- Embedded OS
Introducing the "i.MX 8M Plus SMARC SOM" that we handle!
- Industrial PCs
- Embedded Board Computers
- Embedded OS
Support for multi-OS platforms! Over 10 years of product lifespan program.
- Industrial PCs
- Embedded Board Computers
- Embedded OS
High AI inference performance with industrial-grade availability! Over 10 years of long-term support.
- Industrial PCs
- Embedded Board Computers
- Embedded OS