List of Embedded Board Computers products
- classification：Embedded Board Computers
46～90 item / All 3574 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
![[Case Study] Computer-on-Module Acc...](https://image.mono.ipros.com/public/product/image/323835/IPROS10668290574489247974.jpg?w=280&h=280){kind=small}
Computer-on-module addresses the challenges of time-to-market and scalability for next-generation drone startups.
- Embedded Board Computers
★Case study presentation ongoing!★ [Compatible with 45 countries worldwide × Vehicle-mounted × AI] Edge computing compatible IoT gateway
- Embedded Board Computers
★Case study presentation ongoing!★【Compatible with 45 countries worldwide × Vehicle-mounted × AI】Edge computing compatible IoT gateway
- Embedded Board Computers
★Case study presentation ongoing!★ [Compatible with 45 countries worldwide × Vehicle-mounted × AI] Edge computing compatible IoT gateway
- Embedded Board Computers
3U CompactPCI Serial 4-Channel 1000BASE-T Ethernet Card TCPS892
- Embedded Board Computers
- Communications
3U CompactPCI Serial 4CH Gigabit Ethernet Rear I/O Module TCPS007-TM
- Embedded Board Computers
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
SMARC module equipped with NXP i.MX95, ideal for drone flight control.
- Embedded Board Computers
SMARC short-size module equipped with MediaTek Genio 1200 platform
- Embedded Board Computers
SMARC short-size module equipped with NXP i.MX 8M Mini SoC
- Embedded Board Computers
![CPU module "SMARC" [LEC-iMX6R2]](https://image.mono.ipros.com/public/product/image/98d/2000510685/IPROS63124557240714370705.jpeg?w=280&h=280){kind=small}
NXP i.MX 6 Multicore Arm Cortex-A9 equipped SMARC short-size module
- Embedded Board Computers
![CPU module "SMARC" [LEC-iMX8M]](https://image.mono.ipros.com/public/product/image/831/2000510719/IPROS60774622084045659883.jpeg?w=280&h=280){kind=small}
NXP i.MX 8M equipped SMARC short-size module
- Embedded Board Computers
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280){kind=small}
NXP i.MX 8MPlus equipped SMARC short-size module
- Embedded Board Computers
Accelerating secure IoT design with ADLINK's SoM and Atmark Techno Linux.
ADLINK Technology, a global leader in edge computing, has announced support for the Linux-based "Armadillo Base OS" (ABOS), developed by Atmark Techno and optimized for ADLINK's system-on-module (SoM). By combining ADLINK's high-density SoM with ABOS's embedded security features and long-term maintenance capabilities, IoT manufacturers can reduce development costs and shorten the time to market for secure IoT devices. Advancements in semiconductor technology have improved the performance of system-on-chip (SoC) devices, while also increasing the complexity of circuit board design. ADLINK's SoM integrates the processor, memory (including high-speed LPDDR4X/LPDDR5), and peripheral interfaces into a single module, simplifying carrier board design and reducing development effort.
![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280){kind=small}
NXP/i.MX6 equipped SMARC short-size module
- Embedded Board Computers
The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280){kind=small}
NXP i.MX95 equipped SMARC 2.1 short-size module
- Embedded Board Computers
ADLINK expands its lineup of COM modules with SMARC and OSM modules equipped with NXP i.MX95.
● Based on the NXP i.MX 95, it achieves AI performance of up to 2 TOPS. Compliant with SGeT SMARC 2.2 and OSM 1.2, it provides scalable and efficient edge intelligence. ● OSM-IMX95: A robust 45mm x 45mm solderable module adopting ADLINK's single-sided PCB design. It offers AI-driven performance for compact, power-constrained edge devices. ● SMARC LEC-IMX95: An 82 mm x 50 mm SGeT SMARC 2.2 module. Equipped with 10 GbE, secure boot, and industrial reliability, it enables intelligent IoT and automation. ● Providing customized high-performance edge solutions for various industries through diverse options and flexible ODM customization.
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280){kind=small}
SMARC short-size module equipped with MediaTek Genio 1200 platform.
- Embedded Board Computers
ADLINK has released an AIoT SMARC module featuring the MediaTek SoC, equipped with an 8-core CPU and a 5-core GPU, known as the Genio 1200.
●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module
- Embedded Board Computers
ADLINK releases the first Intel Core Ultra series 3COM Express module for edge AI.
● Achieves up to 180 TOPS for complex edge AI workloads ● Simplifies system integration, especially for graphics-intensive applications, with Intel Arc GPU featuring up to 12 Xe cores ● Maximizes power efficiency and responsiveness with an advanced hybrid CPU architecture (P/E cores and LPE cores) combined with 128GB DDR5 memory ● Adds industrial temperature-rated SKUs. Equipped with IBECC memory and TSN Ethernet, ideal for mission-critical robust applications ● Implements Intel Core Ultra Series 3 in a compact COM-HPC Mini form factor, designed for space-constrained applications. Expected to be available in Q2 2026
NVIDIA Jetson Module: Power-efficient edge AI and embedded computing
- Embedded Board Computers
Jetway Arrow Lake-S compatible H810 chipset LGA1851 socket Mini-ITX board
- Embedded Board Computers
Jetway Arrow Lake-S compatible W880 chipset LGA1851 socket Mini-ITX board
- Embedded Board Computers
Jetway Arrow Lake-S compatible Mini-ITX board with Q870 chipset and LGA1851 socket.
- Embedded Board Computers
AAEON 3.5-inch standard single-board computer
- Embedded Board Computers
Jetway 12th/13th/14th generation Core i class compatible industrial fanless compact PC with expansion slots.
- Embedded Board Computers
Jetway 12th/13th/14th Generation CPU Compatible Chipset H610 Industrial Fanless Compact PC
- Embedded Board Computers
Jetway Arrow Lake-S compatible LGA1851 socket Q870 industrial ATX standard motherboard
- Embedded Board Computers
Jetway Arrow Lake-S compatible LGA1851 socket W880 equipped industrial ATX standard motherboard
- Embedded Board Computers
Jetway Arrow Lake-S compatible LGA1851 socket W880 equipped industrial Micro ATX motherboard
- Embedded Board Computers