List of Embedded Board Computers products
- classification：Embedded Board Computers
226～270 item / All 3615 items
We provide manufacturing technology for neutralization, esterification, sulfonation, phosphorylation, polycondensation reactions, powder mixing, emulsification, and dispersion, etc. *We can also handl...
- Contract manufacturing
Do you have any concerns about contract manufacturing of various chemical products?
We would like to introduce the contract manufacturing services provided by Riten Chemical Co., Ltd. We are a chemical manufacturer based in Kyoto with 70 years of experience. Since our establishment, we have been developing, manufacturing, and selling various surfactants used in the textile and paper industries. Based on the technology and development capabilities we have cultivated over the years, we accept contract manufacturing of various chemical products, so please feel free to contact us. 【Contract Manufacturing Achievements】 ■ Construction waterproofing agents ■ Plant growth promoters ■ Construction waterproofing materials ■ Greening-related agents ■ Chemicals for the electronics industry ■ Wastewater treatment agents ■ Industrial preservatives ■ Special surfactants... We provide more detailed information through related products and catalogs.
Heat resistant up to 1200℃. We will custom-make high-performance insulation covers that ensure safety in the working environment!
- Glass
★Case study presentation ongoing!★ [Compatible with 45 countries worldwide × Vehicle-mounted × AI] Edge computing compatible IoT gateway
- Embedded Board Computers
★Case study presentation ongoing!★【Compatible with 45 countries worldwide × Vehicle-mounted × AI】Edge computing compatible IoT gateway
- Embedded Board Computers
★Case study presentation ongoing!★ [Compatible with 45 countries worldwide × Vehicle-mounted × AI] Edge computing compatible IoT gateway
- Embedded Board Computers
3U CompactPCI Serial 4-Channel 1000BASE-T Ethernet Card TCPS892
- Embedded Board Computers
- Communications
3U CompactPCI Serial 4CH Gigabit Ethernet Rear I/O Module TCPS007-TM
- Embedded Board Computers
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
SMARC module equipped with NXP i.MX95, ideal for drone flight control.
- Embedded Board Computers
SMARC short-size module equipped with MediaTek Genio 1200 platform
- Embedded Board Computers
SMARC short-size module equipped with NXP i.MX 8M Mini SoC
- Embedded Board Computers
![CPU module "SMARC" [LEC-iMX6R2]](https://image.mono.ipros.com/public/product/image/98d/2000510685/IPROS63124557240714370705.jpeg?w=280&h=280){kind=small}
NXP i.MX 6 Multicore Arm Cortex-A9 equipped SMARC short-size module
- Embedded Board Computers
![CPU module "SMARC" [LEC-iMX8M]](https://image.mono.ipros.com/public/product/image/831/2000510719/IPROS60774622084045659883.jpeg?w=280&h=280){kind=small}
NXP i.MX 8M equipped SMARC short-size module
- Embedded Board Computers
![CPU module "SMARC" [LEC-IMX8MP]](https://image.mono.ipros.com/public/product/image/79b/2000598940/IPROS31315477312969060387.jpeg?w=280&h=280){kind=small}
NXP i.MX 8MPlus equipped SMARC short-size module
- Embedded Board Computers
Accelerating secure IoT design with ADLINK's SoM and Atmark Techno Linux.
ADLINK Technology, a global leader in edge computing, has announced support for the Linux-based "Armadillo Base OS" (ABOS), developed by Atmark Techno and optimized for ADLINK's system-on-module (SoM). By combining ADLINK's high-density SoM with ABOS's embedded security features and long-term maintenance capabilities, IoT manufacturers can reduce development costs and shorten the time to market for secure IoT devices. Advancements in semiconductor technology have improved the performance of system-on-chip (SoC) devices, while also increasing the complexity of circuit board design. ADLINK's SoM integrates the processor, memory (including high-speed LPDDR4X/LPDDR5), and peripheral interfaces into a single module, simplifying carrier board design and reducing development effort.
![CPU module "SMARC" [LEC-iMX6]](https://image.mono.ipros.com/public/product/image/75c/2000219877/IPROS5079826362096052175.jpg?w=280&h=280){kind=small}
NXP/i.MX6 equipped SMARC short-size module
- Embedded Board Computers
The newly released SMARC module specification revision 2.1 will be the first open AIoM (AI on Module) specification.
ADLINK Technology, one of the main contributors to the SMARC SGET committee, has announced the release of the SMARC module revision 2.1. The SGET (Standardization Group for Embedded Technologies) has just introduced the latest future-proof specification 2.1. The new features are only additional items that do not affect the multiplexing of existing signals and the pins of the edge connector assigned in the 2.0 specification, making the specification fully backward compatible with the current specification 2.0. The main additions are as follows: - Anticipating the needs of the AI and robotics markets, support for up to four MIPI CSI ports - Expansion of Ethernet ports through multiplexing of SERDES signals on the third and fourth PCIe x1 interfaces - Various minor additions for initially unused pins such as plus 2 GPIO pins and PCIe clock request signals
![CPU module "SMARC" [LEC-IMX95]](https://image.mono.ipros.com/public/product/image/0c2/2001482197/IPROS41015035827848460144.png?w=280&h=280){kind=small}
NXP i.MX95 equipped SMARC 2.1 short-size module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Mini type COM-HPC module equipped with Intel Core Ultra processor (Meteor Lake)
- Embedded Board Computers
ADLINK releases Intel Core Ultra COM-HPC Mini with powerful computing performance in a 95mm x 70mm form factor.
- Equipped with the Intel Core Ultra architecture featuring up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, offering both ultra power and energy efficiency. - 64GB of LPDDR5x memory is directly soldered onto the board, supporting maximum performance in a 95 x 70mm form factor, with an operating temperature range of -40°C to 85°C. - Integrated with up to 16 PCIe lanes, two SATA interfaces, two 2.5GbE Ethernet ports, and multiple DDI/USB4 and USB 3.0/2.0 interfaces for abundant I/O options.
Qualcomm QRB5165 Series Octa-Core SoC Equipped SMARC Short Size Module
- Embedded Board Computers
![CPU module "SMARC" [LEC-MTK-I1200]](https://image.mono.ipros.com/public/product/image/e53/2000717097/IPROS58706350873575624420.jpeg?w=280&h=280){kind=small}
SMARC short-size module equipped with MediaTek Genio 1200 platform.
- Embedded Board Computers
ADLINK has released an AIoT SMARC module featuring the MediaTek SoC, equipped with an 8-core CPU and a 5-core GPU, known as the Genio 1200.
●A short-sized module based on the MediaTek Genio 1200 processor, designed to drive AIoT and 4K graphics applications at the edge, compliant with the SMARC 2.1 specification. ●It features a 2.2GHz octa-core (Cortex-A78 x4 + Cortex-A55 x4) CPU, a 5-core GPU for advanced 3D graphics, an integrated APU (AI Processor Unit) for on-device AI, and supports multiple 4K displays and camera inputs, all configured for excellent power efficiency.
OSM R1.1 Size L module equipped with MediaTek Genio 510 series processor.
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution
Intel Core Ultra Processor Series 3 COM Express R3.1 Type 6 Basic Size Module
- Embedded Board Computers
ADLINK Japan will exhibit at "Japan IT Week: Embedded, Edge, and IoT Development EXPO" held from April 8 (Wednesday) to April 10 (Friday)!
This year, Japan's largest IT exhibition, "Japan IT Week Spring 2026," featuring cutting-edge IT and DX solutions, will be held at Tokyo Big Sight. ADLINK Japan will be exhibiting at the notable Embedded, Edge, and IoT Development EXPO. At this exhibition, we plan to showcase edge computing, smart factories, smart retail, edge AI, GPU solutions, industrial panels, and monitors. We will introduce the latest technologies, including ready-to-use SMARC development kits and portable Pocket AI. ★ This time, we will showcase collaborative demos with six companies ★ 【AMD】Hybrid inference smart register demo 【Allxon】Remote management of edge AI devices 【Daito EM】Highly scalable embedded computers 【BM Nagano】Edge AI high-speed image inspection solution 【Macnica Ultima Company】Generative AI demo using NXP i.MX95, generative AI demo using Hailo 【Marubun】Portable GPU solution