List of Communications products
- classification:Communications
16~30 item / All 2006 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
2 antenna ports, compact and low-cost, fixed-type UHF band RFID reader RS200
- IC tag
- IC tag reader/writer
- Communications
High-performance UHF band RFID reader module based on Impinj R2000 chip.
- IC tag
- IC tag reader/writer
- Communications
On March 22, 2013, we will launch the UHF RFID module RM300 that supports the new frequency band.
Unitech Japan Co., Ltd. will launch the industry's first high-output UHF RFID module, RM300. Orders are scheduled to begin on April 1, 2013. Starting from January 2013, the frequency band for UHF RFID will be transitioned and reorganized, leading to the development of devices such as handheld readers, fixed readers, and printers that utilize UHF RFID, with expectations for market expansion. UHF RFID devices are wireless equipment, and even if products are developed, it is necessary to obtain type certification from the Ministry of Internal Affairs and Communications or construction design certification, which involves costs and time. The RM300 has already obtained construction design certification as a high-output module with 1W, so devices using this module do not need to obtain these certifications again or can do so easily. The RM300 supports and has obtained certification for frequency bands usable not only in Japan but also in the United States, Europe, China, and Taiwan (some are planned). For more details, please refer to the materials.
Audio, only the necessary content for those who need it. A new audio sharing experience realized with Auracast.
- Wireless LAN
- Communications
- Software (middle, driver, security, etc.)
Notice of Participation in "EdgeTech+ West 2026"
We are pleased to announce that we will be exhibiting at "EdgeTech+ West 2026," which will be held at Grand Front Osaka from July 23 (Thursday) to July 24 (Friday), 2026. We sincerely invite you to visit us during this opportunity. <Exhibition Overview> Name: EdgeTech+ West 2026 Dates: July 23 (Thursday) to July 24 (Friday), 2026, 10:00 AM - 5:00 PM Venue: Grand Front Osaka, North Building, B2F, Congre Convention Center, Booth No. A-S24 <Exhibited Products> ■ Energy-efficient Mesh Network We will introduce a facility monitoring solution that easily enables equipment monitoring through battery-powered wireless mesh technology. ■ Embedded Security We will present an integrated security solution for embedded systems, looking ahead to the era of quantum computing. ■ Bluetooth Auracast We will introduce Auracast, the latest technology in Bluetooth, and provide support for the development of Bluetooth products. ■ <Reference Exhibit> AI Utilization and Image Recognition Technology and Applications We will showcase automatic annotation and AI application demos as part of AI utilization and image recognition technology.
We support Bluetooth product development from specification examination to certification acquisition. We ensure that Bluetooth development for embedded devices proceeds smoothly and reliably.
- Communications
- Wireless LAN
- Software (middle, driver, security, etc.)
Make Bluetooth development easier and more reliable. Shorten the development time for embedded devices with SIG-certified SDK.
- Software (middle, driver, security, etc.)
- Communications
- Wireless LAN
For the future of building automation. Building automatic management control system.
- Communications
Introducing building control and management utilizing BACnet IP and BACnet MS/TP!
- Communications
Large-diameter bundling (binding and securing of construction mainline cables) is possible! The thin and flexible strap, along with low insertion resistance, provides excellent workability.
- Binding/Packing Machine
- Communications