List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
136～150 item / All 1031 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.
- Other surface treatment equipment
- Wafer processing/polishing equipment
We will monitor the grinding process in real-time with the Marpos measurement head!
- Wafer processing/polishing equipment
- Production Management System
- Other measurement, recording and measuring instruments
[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.
- Wafer processing/polishing equipment
- Other machine elements
【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.
- Wafer processing/polishing equipment
- Other machine elements
![[Grinding Device] Tape Grinding Uni...](https://image.mono.ipros.com/public/product/image/31b/2000180536/IPROS76454250891536593949.jpeg?w=280&h=280){kind=small}
Polishing equipment that maximizes the characteristics of polishing film.
- Wafer processing/polishing equipment
Processing technology that can polish shafts with complex shapes!
- Wafer processing/polishing equipment
For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.
- Wafer processing/polishing equipment
- Articulated Robot
Precision polishing technology that contributes to the improvement of gear quality!
- Wafer processing/polishing equipment
Innovative processing technology that enables the grinding of complex-shaped main shafts!
- Wafer processing/polishing equipment
![[For Robots] IRF-1000 Complex Shape...](https://image.mono.ipros.com/public/product/image/2044136/IPROS15237369428143763279.jpeg?w=280&h=280){kind=small}
Processing technology that realizes precision grinding of robot joints!
- Wafer processing/polishing equipment
Precision grinding of complex-shaped gears!
- Wafer processing/polishing equipment