List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

286~300 item / All 1005 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

  • small-mistcollector.png
  • air conditioning

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We can accommodate various quantities from small amounts to mass production! We offer a wide variety of silica sand.

  • Wafer processing/polishing equipment

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Ideal for processing in areas where tools cannot reach! Capable of deburring and adding radii, among other tasks.

  • Wafer processing/polishing equipment

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It is possible to provide a large frictional force instantaneously! Due to its high volumetric efficiency, it excels in mass production.

  • Wafer processing/polishing equipment

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Polishing power 10 to 15 times that of a rotary barrel! Processing can be done in a short time.

  • Wafer processing/polishing equipment

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Minimal grinding unevenness, minimizing damage to the product, and enabling stable precision barrels!

  • Wafer processing/polishing equipment

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Reproducibility in sample grinding

  • Wafer processing/polishing equipment

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It is a manual polishing device for a luminescence spectroscopic analysis apparatus.

  • Wafer processing/polishing equipment

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Achieving high-quality polishing that retains the edge through mechanization.

  • Wafer processing/polishing equipment

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We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves edges through mechanization.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Achieving high-quality polishing that preserves the edge through automation.

  • Wafer processing/polishing equipment

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Surtech出展_イプロス500px.jpg

We will exhibit at the SURTECH 2025 trade show.

We will be exhibiting at SURTECH 2025 – Surface Technology Exhibition – which will be held at Tokyo Big Sight from January 29, 2025 (Wednesday). We will introduce the "DLyte," a dry electrochemical polishing machine that uses resin media for ion exchange to grind and polish metals. Exhibition: SURTECH 2025 Location: Tokyo Big Sight, East Hall 3 Organizer: JTB Communication Design, Inc. (Rapid News Publications Ltd.) Date: January 29 (Wednesday) to January 31 (Saturday), 2025 Time: 10:00 AM to 5:00 PM Booth Number: 3X-11 *For inquiries and to download the catalog, please visit here. You can find more detailed information on our website. Request for materials: https://www.nttdata-xam.com/document/ Inquiries: https://www.nttdata-xam.com/contact/

Kyoto, the ever-evolving hub of precision sheet metal! Adapting to flexible manufacturing.

  • 3D CAD
  • Other CAD
  • Wafer processing/polishing equipment

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The corresponding pipe sizes are OD 38.1mm to 76.2mm! Introducing our pipe outer surface polishing machine.

  • Wafer processing/polishing equipment

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Conducting ultra-precision grinding processing for core pins of molds for mobile phone connectors!

  • Wafer processing/polishing equipment
  • Processing Contract

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