List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
376～390 item / All 1011 items
Reduce the workload from handling heavy objects! Here are five case studies that solved customer challenges! We are also accepting free consultations and tests tailored to your work!
- Other conveying machines
Presentation of explanatory materials on JIS and ISO standards. We propose suitable safety barriers from a rich product series! Free rental of demo kits.
- Other safety and hygiene products
The cross-section of electronic components is simple and finishes beautifully!!
- Wafer processing/polishing equipment
- Other abrasives
Interlock covers are also available! We have achieved further efficiency in polishing operations.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for sample preparation for research and development! Successfully reduced vibration and noise significantly.
- Wafer processing/polishing equipment
- Other processing machines
High-precision angular bearings are adopted as the main axis! Achieving a flatness accuracy of ±10μm on the reference table.
- Wafer processing/polishing equipment
- Other processing machines
We offer a wide range of products, including vacuum chuck holders and adhesive holders!
- Wafer processing/polishing equipment
- Other processing machines
- Other machine elements
High-precision and high-efficiency polishing technology! A comprehensive catalog of precision polishing equipment is available as a gift.
- Wafer processing/polishing equipment
We will introduce a wide variety of grinding wheels, from fixed abrasive wheels to free abrasive wheels and polishing cloths.
- CMP Equipment
- Wafer processing/polishing equipment
- Other processing machines
More economical than manually spraying diamond liquid onto the grinding wheel! Introducing the automatic spraying device.
- Wafer processing/polishing equipment
- Other processing machines
- Other physicochemical equipment
There is no edge sagging, and there are no detachments of foreign substances, making it suitable for evaluation using methods such as EPMA!
- Wafer processing/polishing equipment
- Other processing machines
Samples for cross-sectional observation can be created precisely and easily! There is no need to touch or hold the samples directly by hand.
- Wafer processing/polishing equipment
- Other processing machines
Ideal for polishing small samples! Designed and developed to allow one machine to be used for one purpose.
- Wafer processing/polishing equipment
- CMP Equipment
- Other processing machines
A must-see for those struggling with precision and delivery deadlines! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces.
- Wafer processing/polishing equipment
[Newsletter Distribution] "Manufacturing Coating Heads for the Film, LCD, and Battery Industries" / OKD Corporation
A must-see for those struggling with precision and delivery times! We utilize ultra-finishing techniques centered on polishing to achieve ultra-fine and ultra-smooth surfaces for fine precision and smooth surfaces required for coating heads used in FDP and various film and battery manufacturing equipment. Materials such as SUS can be manufactured. We guarantee the requested precision through our processing technology. For delivery times, we can accept partial contracts for each process. For example, we can shorten the time by focusing only on polishing or only on machining! 【Precision List】 ■ Total Length: 4000mm or less ■ Tip Straightness: 0.001mm to 0.010mm or less ■ Inner Surface Flatness: 0.001mm to 0.010mm or less ■ Tip Surface Roughness: 0.1S or less ■ Inner Surface Roughness: 0.05S to 0.2S or less We are currently offering a document summarizing key points to check when requesting coating heads (die coaters)! *For more details, please contact us or download the catalog.
With wrapping processing technology, high-precision finishing is possible. It has low polishing drive power and features an energy-saving design that also considers the environment. [Exhibited at the ...
- Processing Contract
- Wafer processing/polishing equipment
- Other machine tools
Starting from January 23, it will be featured in a precision machining special!
If you are experiencing issues such as "the grinding machine cannot achieve flatness" or "the surface roughness cannot be cleared," please contact us directly. 【Features of Lapping Processing】 ○ Wet processing minimizes thermal distortion to the workpiece, resulting in less machining distortion. ○ Since the workpiece is processed without being chucked, it is less likely to introduce machining stress, leading to minimal changes in precision over time after processing. ○ Flatness that could not be achieved through turning, machining, or grinding can be attained with lapping processing. ○ By performing lapping on the reference surface before precision finishing processes (grinding, machining), high-performance finishing can be achieved.
We will introduce a case study of a customer who is facing the issue of grinding processing delivery times taking over a month!
- Wafer processing/polishing equipment
[Grinding Processing Case Studies] Grinding of carbide cutters from other companies and overseas is also possible.
We would like to introduce a case study that addresses the concerns of customers who are experiencing delivery times of over a month for grinding processing. ■Concern In previous transactions, when requesting grinding processing, the delivery time took over a month, and in urgent situations, it was not possible to meet deadlines, necessitating the maintenance of a larger inventory. Even then, when it was still not possible to meet deadlines, the only option was to stop the production line, which was problematic. ■Proposal Shortening the delivery time for grinding processing. ■Result Three days after sending the urgent grinding processing request, we were able to receive the items back, allowing us to quickly restore the halted production line. The inventory also improved to the minimum necessary quantity, making management easier. ■Case Summary - Issue: Delivery times were over a month, and when deadlines were missed, it was necessary to stop the production line. - Key points of the proposed service: Quick response tailored to the customer's needs.
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It is possible to uniformly grind large quantities of workpieces up to 1000mm wide! It excels in R chamfering processing.
- Other processing machines
- Wafer processing/polishing equipment