List of Wafer processing/polishing equipment products

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• Sensors

We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!

• Other semiconductors
• Processing Contract
• Wafer

We have equipment such as cleaning devices and image dimension measuring instruments! We accept polishing processing of ceramics and other materials.

• Processing Contract
• Wafer processing/polishing equipment

Introducing a single-axis dicing saw with a maximum size of 9 inches by 12 inches and two configurations!

• Plastic processing machines (cutting and rolling)
• Other processing machines
• Wafer processing/polishing equipment

Ideal for line production due to its fixed base design! It performs the work of two sanders with one machine.

• Other processing machines
• Wafer processing/polishing equipment
• Other cutting tools

Ideal for line integration due to its fixed base design! Suitable for a wide range of applications from intermediate grinding to finishing paint polishing.

• Other processing machines
• Wafer processing/polishing equipment

The pass line is constant and suitable for lining! Equipped with a reverse prevention roll that prevents material rebound and improves safety.

• Other processing machines
• Wafer processing/polishing equipment

Each head can be raised and lowered independently! It enables efficient and high-precision processing from thickness regulation to finishing.

• Other processing machines
• Wafer processing/polishing equipment
• Other cutting tools

Ideal for polishing wooden materials such as furniture components and fittings! Easy operation with a color graphic control panel.

• Other processing machines
• Wafer processing/polishing equipment

Introducing the lineup of "SFC20 (dry type)" with a minimum processing length of 90mm, and the "SS series" metal surface grinding and polishing machines!

• Other processing machines
• Wafer processing/polishing equipment

Ideal for line integration due to its fixed base design! The sanding roll can be eccentrically adjusted using a ratchet handle.

• Other processing machines
• Wafer processing/polishing equipment

With One Pass, rough grinding to finishing polishing is possible! The thickness display device makes it easy to see the thickness settings at a glance.

• Other processing machines
• Wafer processing/polishing equipment

By controlling the "polishing droop" of the hole circumference, flat polishing can be achieved.

• Wafer processing/polishing equipment

Adoption of diamond electroplated rolls for grinding rolls significantly increases the lifespan of grinding tools and reduces setup time.

• Wafer processing/polishing equipment

A lineup of lens polishing machines that can accommodate various optical surfaces and interferometers that can measure flat shapes without being affected by the back surface.

• Wafer processing/polishing equipment

Highly versatile UV, green, and IR picosecond lasers: The new standard in picosecond micromachining.

• Wafer processing/polishing equipment

High-output UV and femtosecond lasers enable high-quality, high-precision processing of difficult materials at high speed.

• Wafer processing/polishing equipment