List of Wafer processing/polishing equipment products

  • classification:Wafer processing/polishing equipment

76~90 item / All 1001 items

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Achieves high collection efficiency through electrostatic methods. Offers a wide range of products from large to small sizes. Also compatible with water-soluble oil mist.

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  • air conditioning

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A semi-automatic polishing device that ensures stable processing quality without relying on skilled labor!

  • Wafer processing/polishing equipment

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A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

TAIKO(R) wafer and thin wafer compatible models

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A model suitable for processes where temperature conditions affect adhesion quality and for applications where process variation needs to be minimized.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

A versatile model capable of supporting a wide range of processes from research and development applications to pre-mass production stages.

  • Other semiconductor manufacturing equipment
  • Wafer processing/polishing equipment
  • Mounter

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32232e.jpg

We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."

We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.

We will make it possible to regrind tools with small diameters that were difficult to regrind!

  • Wafer processing/polishing equipment

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Easy tool re-sharpening! Anyone can achieve a uniform finish! Ready to use with a household power supply.

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  • Other surface treatment equipment
  • Wafer processing/polishing equipment

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We will monitor the grinding process in real-time with the Marpos measurement head!

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  • Wafer processing/polishing equipment
  • Production Management System
  • Other measurement, recording and measuring instruments

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[Product demo available] Achieving high efficiency, durability, and flat grinding capability! A new mechanism has been adopted in the pad support section.

  • Wafer processing/polishing equipment
  • Other machine elements

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【Product demo available】Paper size is φ150mm! It is compact and lightweight at 730g, has a long lifespan, and is easy to maintain.

  • Wafer processing/polishing equipment
  • Other machine elements

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【Product demo available】Low failure rate and long lifespan, plus easy maintenance! Easy to operate and does not cause fatigue even with long hours of use.

  • Wafer processing/polishing equipment
  • Other machine elements

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Polishing equipment that maximizes the characteristics of polishing film.

  • Wafer processing/polishing equipment

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Processing technology that can polish shafts with complex shapes!

  • Wafer processing/polishing equipment

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For home appliance parts! Achieving work improvement, labor saving, and uniform product quality through automation.

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  • Wafer processing/polishing equipment
  • Articulated Robot

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