List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
121～135 item / All 1031 items
It won't break even after 1 million repetitions! A mat switch with reliable operation, high durability, and low price. Suitable for options in machine tools as well. Please consult us about delivery t...
- Sensors
We can accommodate high resistance over 10,000 ohms, with diameters ranging from approximately 30 mm to 8 inches, and we also offer thinning and chip processing arrangements!
- Other semiconductors
- Processing Contract
- Wafer
Efficient flat processing of silicon carbide, a difficult-to-machine material. It aims to shorten processing time while stabilizing precision simultaneously.
- Wafer processing/polishing equipment
The best cost-performance machine in the series! Automate deburring on a low budget.
- Wafer processing/polishing equipment
Standard with two axes for the grinding wheel shaft! Additional installation is possible to meet needs.
- Wafer processing/polishing equipment
The easiest model to introduce in the Baritac series!
- Wafer processing/polishing equipment
Achieve an even finish without polishing marks through "planetary motion" with a rotary 4-axis buff!
- Wafer processing/polishing equipment
Equipped with a simultaneous double-sided grinding mechanism that finishes both sides of the workpiece at once!
- Wafer processing/polishing equipment
A versatile diamond polishing machine capable of handling all polishing directions! Ideal for chip-free polishing of single crystal diamonds!
- Diamond cutter
- Wafer processing/polishing equipment
We will be exhibiting at JIMTOF2026.
We will be exhibiting at JIMTOF2026, which will be held from October 26 (Monday) to October 31 (Saturday), 2026. We plan to showcase actual machines such as diamond grinding machines and water laser processing machines. We look forward to your visit.
Equipped with an oscillation mechanism! Supports both deburring and hairline finishing with one machine.
- Wafer processing/polishing equipment
Proposal for Continuous Supply Ultra-Pure Water Production System: Achieving Stable Operation 24 Hours a Day
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Wafer
For any issues with surface grinding, please consult JFC. We can handle both processing of supplied materials and processing with materials included.
- Fine Ceramics
- Other machine elements
- Wafer processing/polishing equipment
A mirror-like surface created by electropolishing! Supporting IT technology with electropolishing that further enhances corrosion resistance.
- Wafer processing/polishing equipment
We provide batch-type cleaning equipment that utilizes cleaning technology and transport/control technology, compatible with various chemical solutions.
- Wafer processing/polishing equipment
Efficiently enhance polishing power with low vibration design! We offer three models of sanders with speed control.
- Wafer processing/polishing equipment
A model that combines a membrane attachment method compatible with TAIKO(R) wafers and a heating function.
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.
TAIKO(R) wafer and thin wafer compatible models
- Other semiconductor manufacturing equipment
- Wafer processing/polishing equipment
- Mounter
We have published the catalog for the vacuum mount "High-Performance Dicing Peripheral Equipment."
We have released the catalog for our new product series "Vacuum Mounter." From general models that can accommodate a wide range of processes, including research and development applications to pre-mass production processes, to our top-tier models designed for high-difficulty processes such as TAIKO(R) applications, thin wafers, and high-value-added devices, we offer a total of 7 models across 4 series. ■ Vacuum Attachment (TV-150 / TV-200 / TV-300) ■ Heating + Vacuum Attachment (TV-200H / TV-300H) ■ TAIKO(R) + Vacuum Attachment (TV-200T) ■ TAIKO(R) + Heating + Vacuum Attachment (TV-200TH) *TAIKO(R) is a registered trademark of Disco Corporation in Japan and other countries.