List of Wafer processing/polishing equipment products
- classification：Wafer processing/polishing equipment
601～630 item / All 1011 items
For those who have isolators. Achieving high chemical resistance and workability. Low cost and short delivery times are also possible for glove box and isolator gloves.
- Work gloves
Notice of participation in 'INTERPHEX Week Tokyo' from May 20 (Wednesday) to May 22 (Friday), 2026.
Ito Corporation will be exhibiting at "INTERPHEX Week Tokyo" held at Makuhari Messe. This exhibition is the largest in Japan, showcasing a wide range of products and services related to the research and manufacturing of pharmaceuticals, cosmetics, and regenerative medicine from 25 countries and regions around the world. Pharmaceutical and cosmetic manufacturers, as well as regenerative medicine companies, will be attending from all over the globe. We will be showcasing "Gloves for Glove Boxes/Isolators" manufactured by Tron Power. We look forward to your visit.
One-stop service from repair to polishing! Polishing that makes it impossible to distinguish the repaired areas.
- Wafer processing/polishing equipment
- Processing Contract
- Other contract services
We polish everything from small items like chopstick rests to artificial bones used in medical applications!
- Wafer processing/polishing equipment
- Processing Contract
- Other contract services
Space-saving! No power supply needed, only two types of consumable parts! It is possible to reduce costs.
- Wafer processing/polishing equipment
- Other processing machines
Flawless mirror finish! Achieving Ra < 0.005μm with dedicated media.
- Wafer processing/polishing equipment
- Other processing machines
Achieve fast and clean finishes on all types of materials! A honing machine that enables stable processing.
- Wafer processing/polishing equipment
- Other machine tools
- Other processing machines
Supporting design and manufacturing from high-precision machining centers to CAD/CAM!
- Other machine tools
- Machining Center
- Wafer processing/polishing equipment
![[NC Lathe] Capable of processing di...](https://image.mono.ipros.com/public/product/image/4b8/2000554199/IPROS03465314320658038562.jpeg?w=280&h=280){kind=small}
The machining accuracy is partially achieved at 0.02 to 0.05! Additionally, we have 6 NC lathes and 3 robots. Please consult us for NC lathe machining!
- lathe
- Wafer processing/polishing equipment
- Processing Contract
It grips a micro 2.0mm IC wafer chip non-contact.
- Other industrial robots
- Wafer processing/polishing equipment
- Wafer
Achieve ultra-short grinding times! We offer horizontal centrifugal barrels and vertical centrifugal barrels.
- Wafer processing/polishing equipment
- Other abrasives
- Other processing machines
The vibrations and recoil during operation are minimal, allowing for a uniform and vivid polished surface.
- Other machine elements
- Wafer processing/polishing equipment
- Other processing machines
The dimensions of the height and width of processed stone can be easily set using a diagonal two-point setting method on a fully automatic side grinding machine.
- Other machine elements
- Wafer processing/polishing equipment
- Other processing machines
Compact and rechargeable! Introducing a polisher with excellent workability that makes a difference in polishing!
- Power tools
- Hand polishing and filing
- Wafer processing/polishing equipment
An automatic chip regrinding machine with improved safety and workability for shutter opening and closing!
- Wafer processing/polishing equipment
Supports φ10 to φ80 and up to 350L! This is the process performed after lathe machining to improve the outer diameter dimensions and surface roughness.
- Processing Contract
- others
- Wafer processing/polishing equipment
I want to polish like this. Please feel free to consult us about outer diameter polishing, inner diameter polishing, end face polishing, and more.
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing examples of processing rubber rolls made from general-purpose rubber as an alternative to whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a case where processing time has been reduced to less than 1/4 as a substitute for whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a case study of a machined tool holder for SCM415 as an alternative to whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Introducing a processing example using a super finisher that achieved a measurement result of Ra0.035μm, replacing whetstone grinding!
- Wafer processing/polishing equipment
- Surface treatment contract service
- Processing Contract
Flexible multi-stage, diverse, high-efficiency polishing of cylindrical shapes! Film cylindrical super finishing machine with lift and carry transport device included.
- Wafer processing/polishing equipment
The world of ultra-fine polishing of the difficult inner surfaces and end faces of cylinders has expanded thanks to the internal unit!
- Wafer processing/polishing equipment
Achieving ultra-fine finishing grinding of the outer diameter in recessed areas of the workpiece using a 3D motion W-cross guide method!
- Wafer processing/polishing equipment
Film polishing always uses a method of continuously feeding in new film! It flexibly accommodates a variety of roll materials!
- Wafer processing/polishing equipment
Powerful performance when mounted on compact general-purpose machines! Unit-type super finisher.
- Wafer processing/polishing equipment
Introduction of a film super finishing device with backup roller diameter and width of φ58×50mm!
- Grinding Machine
- Wafer processing/polishing equipment
Introduction of a film super finishing device with backup roller diameter and width of φ58×100mm!
- Grinding Machine
- Wafer processing/polishing equipment
A 2-way machine for the final polishing process with excellent cost performance.
- Wafer processing/polishing equipment
No nests, achieving uniform organization and hardness, can be produced from 3B to 32B!
- Wafer processing/polishing equipment